Ultrasonic transceiving processing module, ultrasonic detector, and method for detecting grouting fullness of prefabricated component sleeve
A technology for processing modules and detectors, which is applied in the use of sound waves/ultrasonic waves/infrasonic waves for material analysis, processing detection response signals, and use of sound waves/ultrasonic waves/infrasonic waves to analyze solids. problem, to achieve the effect of low cost, small residual vibration of the probe, and convenient use
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Publication Date
- 2019-09-20
- Estimated Expiration
- Not applicable · inactive patent
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Abstract
Description
technical field
[0001] The invention relates to the technical field of prefabricated buildings, in particular to an ultrasonic transceiver processing module, an ultrasonic detector, and a method for detecting the fullness of prefabricated component sleeve grouting. Background technique
[0002] A prefabricated building refers to a building in which some or all of the components of the building are produced in a prefabricated factory, transported to the construction site, and assembled by installation machinery and reliable connections. Compared with the construction of cast-in-place structures, prefabricated buildings have the advantages of convenient construction, fast project progress, and small impact on the surrounding environment. As my country's construction industry promotes green and safe construction, energy saving and emission reduction, improving project quality and promoting the adjustment and development of industrial structure, prefabricated concrete buildings,...
Examples
Embodiment Construction
[0052]The specific implementation of the ultrasonic transceiver processing module, the ultrasonic detector, and the method for detecting the grouting fullness of the prefabricated component sleeve of the present invention will be described in detail below in conjunction with the accompanying drawings.
[0053] See attached figure 1 , the ultrasonic probe 10 includes a housing 1 and a front matching layer 2, a metal gasket 3, a piezoelectric wafer 4, an acoustic matching layer 5 and an electrical matching layer 6 arranged in sequence from front to back in the housing 1, and the front end of the metal gasket 3 is matched with the front The layer 2 is bonded, the rear end is bonded to the piezoelectric chip 4, the piezoelectric chip 4 is connected to the electrical matching 6 through a high-frequency wire, the acoustic matching layer 5 is arranged behind the piezoelectric chip 4, and the electrical matching 6 is an inductance element. The acoustic matching layer and electrical ma...