Lead-free component interconnection welding spot thermoelectric coupling simulation method

Abstract

The invention relates to a lead-free component interconnection welding spot thermoelectric coupling simulation method. The method comprises the following steps that step 1, analyzing a lead-free component interconnection welding spot thermoelectric coupling failure mechanism; step 2, researching an atomic migration hole prediction algorithm; step 3, establishing an overall packaging model; step 4, carrying out simulation modeling of the interconnection welding spot structure; step 5, performing thermoelectric coupling simulation analysis; and step 6, predicting the position of the atomic migration cavity. Based on the basic theory of atomic migration, three driving mechanisms of electromigration, thermal migration and stress migration generated by thermal stress gradient are comprehensively considered, and an atomic migration cavity prediction numerical algorithm is obtained. On the basis, an ANSYS parameterized design language and a Matlab program are used as carriers to form a finite element analysis method for predicting atomic migration cavities of the interconnection welding spots of the lead-free component, and simulation study is carried out on cavity failures of the interconnection welding spots under the thermoelectric coupling condition. The method belongs to the technical field of lead-free component interconnection welding spot thermoelectric coupling reliability simulation.

Description

[0001] (1) Technical field: [0002] The invention relates to a thermoelectric coupling simulation method for interconnect solder joints of lead-free components, which is based on the failure mode and failure mechanism of interconnect solder joints of lead-free components under thermoelectric coupling conditions, and according to the basic theory of atomic migration, comprehensively considers The three driving mechanisms of electromigration, thermal migration and stress migration caused by thermal stress gradients are used to obtain a numerical algorithm for the prediction of atomic migration voids. On this basis, with the ANSYS parametric design language and Matlab program as the carrier, a finite element analysis method for the prediction of atomic migration voids in interconnect solder joints of lead-free components is formed, and the interconnect solder joints of lead-free components under thermoelectric coupling conditions The void failure simulation study was carried out, ...

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Problems solved by technology

[0005] At present, the research on the reliability of solder joints under the condition of thermoelectric coupling mainly has two methods: experiment and numerical simulation. Due to the small size of solder joints, the research funds and time costs are too high simply through experiments. does not meet the requirements of actual conditions, so people need a new numerical simulation method for interconnection solder joints to simplify the analysis process and reduce costs

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