Lead-free component interconnection welding spot thermoelectric coupling simulation method

A technology of thermoelectric coupling and simulation method, which can be used in design optimization/simulation, instrumentation, measurement of electricity, etc., and can solve the problem of high time cost

Inactive Publication Date: 2019-09-27
BEIHANG UNIV
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Problems solved by technology

[0005] At present, the research on the reliability of solder joints under the condition of thermoelectric coupling mainly has two methods: experiment and numerical simulation. Due to the small size of solder joints, the research funds and

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  • Lead-free component interconnection welding spot thermoelectric coupling simulation method
  • Lead-free component interconnection welding spot thermoelectric coupling simulation method
  • Lead-free component interconnection welding spot thermoelectric coupling simulation method

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Embodiment Construction

[0036] The method for thermoelectric coupling simulation of interconnect solder joints of lead-free components of the present invention will be further described in detail below in conjunction with the accompanying drawings, and the specific steps are as follows:

[0037] Step 1: Failure mechanism analysis of lead-free component interconnection solder joint thermoelectric coupling

[0038] Under the coupling effect of thermal field and electric field, the main failure mechanism of interconnection solder joints is atomic migration driven by electromigration, thermal migration and stress migration. Due to the current blocking effect, the high current density generates Joule heat in the interconnection solder joints, thereby forming a large temperature gradient, which drives the metal atoms to undergo thermal migration; Perform stress migration. Therefore, the failure of lead-free interconnect solder joints under thermoelectric coupling conditions is actually a common result of ...

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Abstract

The invention relates to a lead-free component interconnection welding spot thermoelectric coupling simulation method. The method comprises the following steps that step 1, analyzing a lead-free component interconnection welding spot thermoelectric coupling failure mechanism; step 2, researching an atomic migration hole prediction algorithm; step 3, establishing an overall packaging model; step 4, carrying out simulation modeling of the interconnection welding spot structure; step 5, performing thermoelectric coupling simulation analysis; and step 6, predicting the position of the atomic migration cavity. Based on the basic theory of atomic migration, three driving mechanisms of electromigration, thermal migration and stress migration generated by thermal stress gradient are comprehensively considered, and an atomic migration cavity prediction numerical algorithm is obtained. On the basis, an ANSYS parameterized design language and a Matlab program are used as carriers to form a finite element analysis method for predicting atomic migration cavities of the interconnection welding spots of the lead-free component, and simulation study is carried out on cavity failures of the interconnection welding spots under the thermoelectric coupling condition. The method belongs to the technical field of lead-free component interconnection welding spot thermoelectric coupling reliability simulation.

Description

[0001] (1) Technical field: [0002] The invention relates to a thermoelectric coupling simulation method for interconnect solder joints of lead-free components, which is based on the failure mode and failure mechanism of interconnect solder joints of lead-free components under thermoelectric coupling conditions, and according to the basic theory of atomic migration, comprehensively considers The three driving mechanisms of electromigration, thermal migration and stress migration caused by thermal stress gradients are used to obtain a numerical algorithm for the prediction of atomic migration voids. On this basis, with the ANSYS parametric design language and Matlab program as the carrier, a finite element analysis method for the prediction of atomic migration voids in interconnect solder joints of lead-free components is formed, and the interconnect solder joints of lead-free components under thermoelectric coupling conditions The void failure simulation study was carried out, ...

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Application Information

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IPC IPC(8): G06F17/50G01R31/28
CPCG01R31/2858G01R31/2874G06F30/23
Inventor 张素娟袁佳鑫姜贸公李颜若玥
Owner BEIHANG UNIV
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