Punching die and method for processing semiconductor chip by using same
A punching die and semiconductor technology, applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve the problems of potential safety hazards, low automation, low production efficiency, etc., to save processing time, high automation, The effect of improving productivity
Pending Publication Date: 2019-09-27
WUXI RED MICROELECTRONICS CORP
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Problems solved by technology
[0003] In view of the low degree of automation of the molds used for the rib cutting and product forming processing of the MSP40-GDF and MSP-GDR two frames in the prior art, the method of manually pushing the product to move is time-consuming, laborious, low in production efficiency, and has potential safety hazards problem, the present invention provides a semiconductor chip punching die, which has a high degree of automation, saves time and effort, can greatly improve production efficiency, and can reduce the probability of worker injury at the same time, ensuring production safety
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[0036] See Figure 1 to Figure 9, a semiconductor chip die-cutting mold, which includes a processing table 1, a rib cutting device 2 is arranged on the processing table 1, and a bending forming device 3 is provided on one side of the rib cutting device 2, and the rib cutting device 2 and the bending forming device 3 is provided with the first track 4 arranged in parallel, the other side of the rib cutting device 2 is provided with a pushing mechanism 5, the pushing mechanism 5 is arranged correspondingly to the rib cutting device 2, and one side of the bending forming device 3 is adjacent to the workbench A tube loading device 7 is provided at the position of the tube loading device 7 and a second rail 6 arranged in parallel is arranged between the tube loading device 7 and the bending forming device. The two ends of the first rail 4 extend straight to both sides respectively, and the One end passes through the cutting plate 21 on the rib cutting device 2 and corresponds to on...
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The invention discloses a semiconductor chip punching die, which is high in automation degree, saves time and labor, can greatly improve the production efficiency, and can improve the production safety. The punching die comprises a machining table and a rib cutting device, wherein a bending forming device is arranged at one side of the rib cutting device. A first track arranged in parallel is arranged between the rib cutting device and the bending forming device. A pushing mechanism is arranged at the other side of the rib cutting device, and the pushing mechanism is arranged corresponding to the rib cutting device; a pipe loading device is arranged at one side of the bending and forming device; a second track which is arranged in parallel is arranged between the pipe loading device and the bending forming device. The two ends of the first rail extend towards the two sides in a straight line mode. One end of the first track penetrates through a material cutting plate on the rib cutting device and corresponds to one end of a push rod of the pushing structure, and the other end of the first track penetrates through the bending forming device to be communicated with the inlet end of the second track; the outlet end of the second track is communicated with a material pipe of the pipe loading device, and the second track and the pipe loading device are obliquely arranged downwards at a certain angle with the horizontal plane.
Description
technical field [0001] The invention relates to the technical field of semiconductor chip processing, in particular to a semiconductor chip punching die. Background technique [0002] The production process of semiconductor chip packaging products needs to go through processes such as rib cutting, forming, and tube loading. At present, the punching dies used for MSP40-GDF or MSP-GDR product processing mainly include rib cutting devices, bending and forming Each device is connected by rails, but its degree of automation is low. The movement between each device is mainly realized by directly pushing each product manually. The manual pushing of the product is time-consuming and laborious, which seriously affects production efficiency. The way of manually pushing the product is very easy to cause workers to be injured due to equipment malfunction or misoperation, and there is a great potential safety hazard. Contents of the invention [0003] In view of the low degree of auto...
Claims
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IPC IPC(8): H01L21/67H01L21/48
CPCH01L21/67092H01L21/67236H01L21/4842
Inventor 盛振
Owner WUXI RED MICROELECTRONICS CORP