Production Line Fault Judgment Method Based on Resampling Integrated Feature Selection Algorithm

Abstract

The invention relates to a production line fault judgment method based on a resampling integrated feature selection algorithm, comprising the following steps: Step 1: constructing a new sample subspace based on a resampling method based on an unbalanced data set IDS; Step 2: using a random forest algorithm Perform feature selection on each sample subspace to obtain the feature subsets of each subspace; Step 3: Merge the feature subsets of each subspace into a new feature space collection; Step 4: Use the denoising autoencoder to classify the new feature Dimensionality reduction is performed on the spatial collection to obtain the input of the prediction model; Step 5: According to the input of the prediction model, the random forest algorithm is used to establish a fault prediction model, and the fault prediction model is used to monitor and judge the real-time fault of the production line. Compared with the prior art, the invention has the advantages of high accuracy, good robustness and the like.

Description

technical field [0001] The invention relates to the technical field of fault judgment in the chip manufacturing process of a semiconductor manufacturing enterprise, in particular to a production line fault judgment method based on a resampling integrated feature selection algorithm. Background technique [0002] With the widespread application of smart electronic devices in people's lives, the global semiconductor market has developed rapidly in recent years. However, unlike the situation in which the proportion of the integrated circuit design industry in the industrial structure has increased significantly, the proportion of the wafer manufacturing industry has not changed much, and wafer manufacturers are still facing severe market challenges. [0003] During the manufacturing process of the semiconductor production line, there may be some events that are not arranged according to the established scheduling plan, such as production line failure, emergency orders, etc. Th...

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Problems solved by technology

Most of the above inventions only involve fault prediction at the equipment layer, and there are few studies on the characteristics of high-dimensional industrial big data in complex manufacturing environments, which are not suitable for manufacturing environments represented by semiconductor manufacturing systems

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