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UV LED all-inorganic packaging structure with prompt function

A technology of reminder function and packaging structure, which is applied in the direction of electrical components, electrical solid devices, circuits, etc., can solve the problems of lack of integrated products with UV functions, can not see light, etc., and achieve the effect of enhancing stability and improving working life

Active Publication Date: 2019-10-08
HGC (WUHAN) TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Since the wavelength of UVC LED is in the invisible light band, users cannot see any light when using UVC LED, so it will cause users a problem whether the UVC LED is working normally
At the same time, the current application classification of UV LED packaging products is clear. A single product has only one function. For example, UVC products only have sterilization functions, and UVA products only have UV curing and air purification functions, and there is a lack of integrated UV functions.

Method used

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  • UV LED all-inorganic packaging structure with prompt function
  • UV LED all-inorganic packaging structure with prompt function
  • UV LED all-inorganic packaging structure with prompt function

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] Substrate 1 is an alumina substrate, which is pre-treated and cleaned, and then 2 through-hole pairs are drilled on the alumina substrate by laser, and the 2 through-hole pairs are arranged side by side, and the through-holes are filled with conductive metal by sputtering Yes, the conductive metal is copper, and a conductive metal layer with a thickness of 10 μm is formed on the upper and lower surfaces of the substrate.

[0028] Such as figure 1 and figure 2 As shown, the upper surface and the lower surface of the substrate 1 are covered with photoresist by means of yellow light lithography, and after the photoresist covers the substrate 1, exposure, development, etching, and film removal are performed. The uncovered area on the upper surface forms pad pair 1 3 and pad pair 4 , the area below pad pair 3 and the uncovered area on the lower surface of substrate 1 forms electrode pair 10 , pad pair 2 4 below, and the substrate 1 The uncovered area of ​​the lower surfac...

Embodiment 2

[0036] Such as Figure 5 As shown, the substrate 1 is an aluminum nitride substrate, which is pre-treated and cleaned, and then a through-hole pair is drilled on the aluminum nitride substrate by deep reactive ion etching, and the conductive metal is filled with the through-hole pair by sputtering. The conductive metal is copper, and a conductive metal layer with a thickness of 1000 μm is formed on the upper and lower surfaces of the substrate.

[0037] Such as Figure 5 and Figure 6 As shown, the upper surface and the lower surface of the substrate 1 are covered with photoresist by means of yellow light lithography, and after the photoresist covers the substrate 1, exposure, development, etching, and film removal are performed. The uncovered area on the upper surface forms a pair of pads 3 14, the area below the pair of pads and the uncovered area on the lower surface of the substrate forms an electrode pair 3 16, and a thermoelectric separation structure 11 is formed betw...

Embodiment 3

[0042] Such as Figure 7 As shown, substrate 1 is an aluminum nitride substrate, which is pre-treated and cleaned, and then 2 pairs of through holes are drilled on the aluminum nitride substrate by deep reactive ion etching, and the 2 pairs of through holes are arranged side by side. The method is to fill the pair of through holes with conductive metal, the conductive metal is copper, and a conductive metal layer with a thickness of 650 μm is formed on the upper and lower surfaces of the substrate 1 respectively.

[0043] Such as figure 2 As shown, the upper surface and the lower surface of the substrate 1 are covered with photoresist by means of yellow light lithography, and after the photoresist covers the substrate 1, exposure, development, etching, and film removal are performed. The uncovered area on the upper surface forms pad pair one 3 and pad pair two 4, the area below pad pair one 3 and the uncovered area on the lower surface of the substrate forms electrode pair o...

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Abstract

The invention relates to the technical field of LED packaging, and provides a UV LED all-inorganic packaging structure with a prompt function. The UV LED all-inorganic packaging structure comprises asubstrate, a UVA chip, a UVC chip and a sealing cover, wherein the UVA chip and the UVC chip are arranged on the substrate, the sealing cover includes a metal frame which is fixed on the substrate andsurrounds the UVA chip and the UVC chip and a cover plate which is arranged on the upper end face of the metal frame, and the cover plate is suspended above the UVA chip and the UVC chip. The packaging structure can play a role of prompting so as to enable a user to receive visible light signals, and can have an effect of increasing the packaged lamp beads, so that the packaging structure can simultaneously have the functions of sterilization and disinfection of UVC lamp beads and the functions such as ultraviolet curing and air purification of UVA lamp beads. Meanwhile, the adopted all-inorganic packaging structure is high in stability and long in service life.

Description

technical field [0001] The invention relates to the field of LED packaging, in particular to a UV LED all-inorganic packaging structure with a prompt function. Background technique [0002] The emerging ultraviolet light source adopts the principle of LED light emission, called "UV LED". Compared with the traditional mercury lamp ultraviolet light source, it has the following advantages: 1. Ultraviolet LED is a solid-state lighting device with stable mechanical structure, portability, impact resistance, and low working voltage. Small size and no need for complex drive circuits; 2. The UV LED has a high response rate and can be used immediately without preheating and other complicated operations; Continuously adjustable; 4. The UV LED material does not contain harmful substances to the environment. At the same time, the UV LED saves up to 70% of energy, which is a real environmental protection and energy-saving light source; 5. The life of the UV LED is more than 5000 hours, ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L25/075H01L33/56
CPCH01L25/0753H01L33/56
Inventor 孙雷蒙杨丹刘芳李坤
Owner HGC (WUHAN) TECH CO LTD
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