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Wafer stacking alignment measurement device and method

A technology for aligning measurement and detection devices, applied in cleaning methods and tools, chemical instruments and methods, cleaning methods using gas flow, etc., to achieve the effects of improving product yield, ensuring quality, and preventing scratches

Active Publication Date: 2019-10-11
CHANGXIN MEMORY TECH INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In view of this, an embodiment of the present invention provides a wafer stack alignment measurement device and its measurement method to solve or alleviate the technical problems existing in the prior art, and at least provide a beneficial option

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  • Wafer stacking alignment measurement device and method
  • Wafer stacking alignment measurement device and method
  • Wafer stacking alignment measurement device and method

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Embodiment Construction

[0043] In the following, only some exemplary embodiments are briefly described. As those skilled in the art would realize, the described embodiments may be modified in various different ways, all without departing from the spirit or scope of the present invention. Accordingly, the drawings and descriptions are to be regarded as illustrative in nature and not restrictive.

[0044] In describing the present invention, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", " Back", "Left", "Right", "Vertical", "Horizontal", "Top", "Bottom", "Inner", "Outer", "Clockwise", "Counterclockwise", "Axial" , "radial", "circumferential" and other indicated orientations or positional relationships are based on the orientations or positional relationships shown in the drawings, which are only for the convenience of describing the present invention and simplifying the description, rather than indicating or im...

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PUM

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Abstract

The invention relates to a wafer stacking alignment measurement device and method. The device comprises a carrying table body and is provided with an upper end face. A cleaning device is provided witha spray head arranged on the side face of the carrying table body. One end of the spray head is provided with a nozzle, and the other end of the spray head is connected with a pipe. A detection device is arranged at a position higher than the upper end face of the carrying table body and the outlet end of the spray head. A control system is used for driving and controlling the carrying table bodyand the spray head. The method comprises the steps that wafers are conveyed to the loading position of the carrying table body; meanwhile, the control system controls the carrying table body to moveto a preset position, gas is conveyed into the spray head through the pipe, and the gas is sprayed out of the nozzle to blow and sweep the detection device; and after cleaning is completed, the carrying table body moves to the loading position for loading the wafers, and the wafers are put on the upper end face of the carrying table body. By means of the nozzle of the wafer stacking alignment measurement device, when a detection face of an optical module is cleaned, pollutant can be blown to the position away from the carrying table body, and the problem that the pollutant falls onto the surfaces of the wafers to scratch the wafers is prevented.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a wafer lamination alignment measurement device and a measurement method thereof. Background technique [0002] When using the stack alignment measurement device to measure the stacking status of the wafers, since the surface of the detection device (including the optical components) is easy to attach contaminants, during the relative movement of the wafer and the optical components, the optical components Contaminants can fall onto the surface of the wafer, such as figure 1 As shown, during the working process of the measuring device, the pollutants will move on the surface of the wafer 100 with a certain trajectory 101, thereby scratching the surface of the wafer 100, affecting the graphics on the surface of the wafer 100, and reducing the yield of the product. . [0003] The above information disclosed in this Background section is only for enhancement of understandin...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B08B5/02
CPCB08B5/02B08B2205/00Y02P70/50
Inventor 不公告发明人
Owner CHANGXIN MEMORY TECH INC