Self-positioning splicing method based on mark circle

A marking circle and self-positioning technology, applied in electrical components, printed circuit manufacturing, printed circuits, etc., can solve the problems of winding, easy deformation, and difficult processing of flexible circuit boards, achieving high splicing accuracy, reducing splicing costs, and realizing The effect of automatic stitching

Inactive Publication Date: 2019-10-11
上海凌渡电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the characteristics of flexible circuit boards that are easy to deform, it is easy to be bent, wound or defective due to factors such as static electricity and air pressure during the splicing process of flexible circuit boards, which makes flexible circuit boards difficult to process.

Method used

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  • Self-positioning splicing method based on mark circle

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Embodiment Construction

[0025] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0026] see figure 1 , the present invention provides a technical solution: a self-positioning splicing method based on marker circles, comprising the following steps:

[0027] S1. Build a fixed platform 1 for the flexible circuit board motherboard 3 and a multi-degree-of-freedom platform 2 for the flexible circuit board sub-board 4;

[0028] S2. Set the two first positioning holes on the flexible circuit board motherboard 3 on the two first positioning column...

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Abstract

The invention discloses a self-positioning splicing method based on a mark circle. The method comprises the following steps of S1, building a fixed platform aiming at a flexible circuit board mother board, and a multi-degree of freedom platform aiming at a flexible circuit board son board; S2, sleeving two first positioning holes in the flexible circuit board mother board on two first positioningcolumns on the fixed platform, and sleeving two second positioning holes in the flexible circuit board son board on two second positioning columns on the multi-degree of freedom platform; and S3, photographing the flexible circuit board mother board and the flexible circuit board son board via an industrial camera, calibrating the positions of the two first positioning columns as two mark circles,and calibrating the positions of the two second positioning columns as two correction circles. By using the method provided by the invention for splicing the flexible circuit boards, the splicing quality of the circuit boards can be effectively improved, the splicing accuracy is high, the splicing cost also can be reduced, and the flexible circuit boards can be automatically spliced.

Description

technical field [0001] The invention relates to the technical field of circuit board splicing, in particular to a self-positioning splicing method based on a marker circle. Background technique [0002] Flexible circuit boards are printed circuits made of flexible insulating substrates, which have many advantages that rigid printed circuit boards do not have. It is easy to bend, wind and fold, and can be arranged arbitrarily according to the requirements of space layout, and can be moved and stretched arbitrarily in three-dimensional space, so as to achieve the integration of component assembly and wire connection. Due to the characteristics of flexible circuit boards that are easy to deform, static electricity and air pressure are likely to cause bending, winding or defects during the splicing process of flexible circuit boards, making flexible circuit boards difficult to process. [0003] How to improve the splicing quality of the flexible circuit board and reduce the spl...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/36
CPCH05K3/365H05K3/368
Inventor 郝艳军
Owner 上海凌渡电子科技有限公司
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