The application relates to the field of display module design, and provides a preparation process of a full-flip COB mirror display module and a
laser cutting machine, wherein the preparation process comprises the following steps: S1, incoming inspection of a PCB substrate; S2, fixed-pointing of full-flip RGB LED chips on the PCB substrate; S3,
reflow soldering of the chips in
nitrogen; S4, vacuum mold encapsulation of a COB display layer; S5, fine
cutting of a process edge of the PCB substrate; S6, cleaning and
plasma activation of super-
thin glass; S7, mutual adhesion of the super-
thin glass and a mirror high-light encapsulation layer through an OCA optical
adhesive layer; S8, high-pressure defoaming treatment; S9,
laser cutting; S10, fine
polishing of an edge of the super-
thin glass; S11, annular sealing point gluing at a joint between the super-thin glass and the PCB substrate, constant-temperature solidification, and preparation of a COB display module; S12, full inspection testing; and S13, repair of defective products. Therefore, the problems of easy edge collapse, low precision and poor yield of existing processes can be solved, and the synchronization of the COB display module
thinning, super-high splicing precision, high mirror quality and high yield in
mass production can be realized.