Forced convection micro-channel heat dissipation structure and manufacturing method thereof, and electronic device

Abstract

The invention provides a forced convection micro-channel heat dissipation structure. The forced convection micro-channel heat dissipation structure comprises: at least two heat dissipation units whichare sequentially stacked; a plurality of heat dissipation channels, wherein the heat dissipation channels are arranged on each heat dissipation unit; at least one inlet and at least one outlet, wherein the at least one inlet and the at least one outlet are opened on the heat dissipation units being in contact with a chip; at least two circulation channels which are arranged on other heat dissipation units not in direct contact with the chip so as to communicate the heat dissipation channels on the adjacent heat dissipation units; at least two negative thermal expansion bodies, wherein one negative thermal expansion body is correspondingly filled in one circulation channel and is used for conducting or not conducting the heat dissipation channels of the adjacent heat dissipation units; anda cover plate covering the heat dissipation unit on the top layer, wherein at least one air inlet and at least one air outlet are formed in the cover plate, and the at least one air inlet and the atleast one air outlet communicate with the heat dissipation channel on the heat dissipation unit on the top layer. The invention also provides a manufacturing method of the heat dissipation structure and an electronic device applying the heat dissipation structure.

Description

technical field [0001] The invention relates to the field of microelectronic chips, in particular to a forced convection micro-channel cooling structure, a manufacturing method and an electronic device. Background technique [0002] Now electronic equipment is rapidly developing towards high integration, high assembly density, and high operating speed. As the core of electronic equipment, electronic chips are constantly shrinking due to their integration, packaging density, and operating clock frequency. , the calorific value per unit area of ​​electronic chips continues to increase, especially for high-power electronic equipment. The continuous increase of heat generation per unit area of ​​electronic chips can easily cause a sharp rise in the temperature of the junction region, and the high temperature of the junction region will have an adverse effect on the performance of electronic chips and electronic equipment. According to statistics, 55% of electronic equipment fai...

AI Technical Summary

Problems solved by technology

[0004] However, the existing microfluidic channel heat dissipation structure is mainly suitable for electronic chips with a heating power density below 1000 W / cm2, which cannot meet the heat dissipation requirements of high-power electronic chips.

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