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Circuit board assembly and electronic equipment

A circuit board assembly and circuit board technology, applied in the direction of circuits, printed circuits, electrical components, etc., can solve the problems of large thickness and high production cost of electronic equipment, and achieve cost reduction, material and production cost reduction, and high-speed signal loss. Effect

Active Publication Date: 2021-03-09
NEW H3C TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In order to meet the needs of dense pins, this type of chip usually adopts ball grid array packaging technology (Ball Grid Array, BGA). The outgoing line in the printed circuit board (PCB) has brought great challenges, which makes the required number of layers of PCB more and more, and the thickness is also increasing, which causes problems such as high production cost of electronic equipment

Method used

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  • Circuit board assembly and electronic equipment
  • Circuit board assembly and electronic equipment
  • Circuit board assembly and electronic equipment

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Embodiment Construction

[0027] In order to make the purpose, technical solutions and advantages of the embodiments of the present disclosure clearer, the technical solutions in the embodiments of the present disclosure will be clearly and completely described below in conjunction with the drawings in the embodiments of the present disclosure. Obviously, the described embodiments It is a part of the embodiments of the present disclosure, but not all of them. The components of the disclosed embodiments generally described and illustrated in the figures herein may be arranged and designed in a variety of different configurations.

[0028] Accordingly, the following detailed description of the embodiments of the present disclosure provided in the accompanying drawings is not intended to limit the scope of the claimed disclosure, but merely represents selected embodiments of the present disclosure. Based on the embodiments in the present disclosure, all other embodiments obtained by persons of ordinary sk...

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Abstract

The circuit board assembly and the electronic device provided by the present disclosure relate to the technical field of electronic assembly. The circuit board assembly includes a circuit board, a BGA chip and a high-speed cable. The circuit board has a top surface and a bottom surface, a plurality of first via holes penetrating the top surface and the bottom surface are opened on the circuit board, and the BGA chip is arranged on the top surface. The multiple high-speed signal pads of the BGA chip are respectively connected to one end of the multiple first vias in a one-to-one correspondence. The high-speed cable includes a plurality of connection heads, and the plurality of connection heads are respectively connected to the bottom surface in a one-to-one correspondence with the other ends of the plurality of first via holes. The circuit board assembly can not only improve the signal quality on the link, increase the trace length of the high-speed signal, but also has a simple process and can reduce the cost of circuit board materials and technology.

Description

technical field [0001] The present disclosure relates to the technical field of electronic assembly, in particular, to a circuit board assembly and electronic equipment. Background technique [0002] With the development of products, the functions of chip integration are becoming more and more complex, making the size of chips larger and higher, and the speed is getting higher and higher, from the original 10G to 25G, 56G, and 112G and other high-frequency development. In order to meet the needs of dense pins, this type of chip usually adopts ball grid array packaging technology (Ball Grid Array, BGA). The outgoing line in the printed circuit board (PCB) has brought great challenges, which makes the required number of layers of the PCB more and more, and the thickness is also increasing, which causes problems such as high production cost of electronic equipment. Contents of the invention [0003] The purpose of the present disclosure includes providing a circuit board ass...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/18H01R12/58
CPCH01R12/58H05K1/182H05K2201/10189H05K2201/10734
Inventor 姜田子
Owner NEW H3C TECH CO LTD
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