A chip adsorption device

Abstract

The invention relates to the technical field of chip testing, and discloses a chip adsorption device, including an adsorption device, a suction port dust-proof device is slidably connected to the bottom of the suction device, and the suction port dust-proof device is directly above and fixed on the adsorption device. The first compression spring is connected, the upper end of the adsorption device is fixedly connected with the first rolling bearing, the top of the first rolling bearing is fixedly connected with the base, and the inner side of the lower part of the base is fixedly connected with the ratchet shell. Through the movement of the rectangular slider on the suction port dust-proof device in the wide chute, the first compression spring pushes the suction port dust-proof device back to its original position. During the return process, the inner wall of the suction hole and suction ring is cleaned, and the hole and suction ring are cleaned. Closed, the external clamping structure set on the ratchet shell cooperates with the one-way rotation device set outside the bottom of the adsorption device, this knot achieves the effect of adjusting the angle of the chip and fixing the chip.

Description

technical field [0001] The invention relates to the technical field of chip testing, in particular to a chip adsorption device. Background technique [0002] In recent years, the development of integrated circuits tends to be smaller in size, so that each chip can package more circuits, which can make the smart products we make smaller and more portable. As the size shrinks, almost all indicators Improved, the unit cost and switching power consumption are reduced, and the speed is increased. Modern computing, manufacturing, transportation systems, and the Internet all rely on the existence of integrated circuits, so the digital revolution brought about by integrated circuits is a very important event in human history. [0003] After the integrated circuit is manufactured, it is installed on the chip. During the test, the chip to be tested needs to be adsorbed to the probe. However, the current chips are relatively small, resulting in insufficient adsorption force, and the s...

AI Technical Summary

Problems solved by technology

[0005] Aiming at the deficiencies of the prior art, the present invention provides a chip adsorption device, which has the function of automatically cleaning the inner wall of the suction hole at the end of each work and closing the suction hole when not working, and has the advantages of improving work efficiency by rotating the device, and solves the problem of suction The hole is easy to block, the traditional adsorption device cannot be rotated and adjusted, and the test of the integrated circuit on the chip cannot be efficiently completed.

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