Silicon wafer processing device and method
A technology for processing devices and silicon wafers, which is applied in the direction of transportation and packaging, conveyor objects, electrical components, etc., can solve the problems of silicon wafer edge warping and edge collapse, so as to improve flatness and prevent edge warping or edge collapse , the effect of precision processing
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[0042] In order to make the technical problems, technical solutions and advantages to be solved by the present invention clearer, the following will describe in detail with reference to the drawings and specific embodiments.
[0043] The terms "first", "second" and the like in the description and claims of the present invention are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It is to be understood that the data so used are interchangeable under appropriate circumstances such that the embodiments of the invention described herein are, for example, capable of practice in sequences other than those illustrated or described herein.
[0044] see figure 1 with figure 2 , the embodiment of the present invention provides a silicon wafer processing device 1 , the silicon wafer processing device 1 may be a final polishing machine, and the silicon wafer processing device 1 includes: a polishing head 11 , an annular mold 12...
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