Hybrid integrated circuit tube shell and method for preventing glass insulator from breaking

A technology of hybrid integrated circuits and glass insulators, applied in circuits, insulators, electrical components, etc., can solve problems such as sealing failure, glass insulator cracks, product scrapping, etc., and achieve the effect of reducing stress and preventing cracks

Pending Publication Date: 2019-10-22
西安伟京电子制造有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The integrated circuit shell is an important part of the hybrid integrated circuit. It mainly plays the role of circuit support, electrical signal transmission, heat dissipation, sealing and protection. The shallow-cavity integrated circuit shell is the most commonly used shell type for hybrid integrated circuits. Nearly With the continuous improvement of circuit density in recent years, circuit design has put forward higher requirements for shallow-cavity integrated circuit shells, but the traditional shell structure design is difficult to meet the requirements of circuit design. The main problems are as follows: In order to increase circuit density, The circuit design needs to lay more circuits inside the shell under the condition of constant length, width and height, and add more input and output electrical signal connections on the shell, but increase the input and output electrical signal connection leads of the integrated circuit shell. (abbreviation: outer lead), will inevitably lead to the reduction of the strength of the side wall of the integrated circuit case. When the strength of the side wall of the case is reduced, there will be a large mechanical stress during the subsequent circuit sealing package and test process. This stress will Cause the deformation of the side wall of the tube shell, because the side wall of the tube shell is embedded with glass insulators, so once the deformation stress of the metal side wall around the glass insulator is greater than the strength of the glass insulator, it will cause cracks in the glass insulator, resulting in seal failure, which means that the seal failure means end-of-life
In order to solve this problem, designers usually strengthen the strength of the side wall of the shell by increasing the thickness of the side wall of the shell, that is, by enhancing the stress resistance of the side wall of the shell to resist the packaging stress, but increasing the thickness of the side wall of the shell It will reduce the space inside the integrated circuit shell, which in turn makes it more difficult to increase the circuit density.

Method used

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  • Hybrid integrated circuit tube shell and method for preventing glass insulator from breaking
  • Hybrid integrated circuit tube shell and method for preventing glass insulator from breaking
  • Hybrid integrated circuit tube shell and method for preventing glass insulator from breaking

Examples

Experimental program
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Effect test

Embodiment 1

[0023] Embodiment 1: as figure 1 , figure 2 and image 3 A hybrid integrated circuit case is shown, including a side wall 1 of the case and a plurality of insulator mounting holes embedded in the side wall 1 of the case, glass insulators 2 are installed in the mounting holes of the insulator; the pressure-bearing end of the side wall 1 of the case Elastic pressure strips 3 are provided;

[0024] On the basis of the traditional integrated circuit case, four elastic stress bars 3 are arranged on the pressure-bearing end faces of the four side walls 1 of the case. The stress of the wall 1 ensures that the glass insulator 2 will not be damaged by the stress conducted by the side wall 1 of the shell and cause cracks.

Embodiment 2

[0025] Embodiment 2: On the basis of Embodiment 1, the stiffness coefficient of the elastic stress strip 3 is smaller than that of the side wall 1 of the casing, so when the circuit casing is installed, it is ensured that the elastic stress strip 3 is deformed first.

Embodiment 3

[0026] Embodiment 3: On the basis of Embodiment 2, the elastic stress strip 3 is integrated with the shell side wall 1 , and the elastic stress stress strip 3 forms a stepped structure with the end of the shell side wall 1 .

[0027] Now take the glass insulator 2 as an example to describe this technical solution in detail: the height of the side wall 1 of the integrated circuit shell is 8mm, and the height of the side wall 1 of the normal thickness is 7mm, the thickness is 2.5mm, and the step-like elasticity The bead 3 should have a height of 1mm and a thickness of 1.25mm.

[0028] The tensile strength of the glass is 3.4*10-7Pa. When the mechanical stress on the glass insulator 2 is greater than this tensile strength, the glass insulator 2 will crack. Use the traditional standard integrated circuit shell to simulate the installation status of the analog circuit shell. , the measured stress around the glass insulator 2 reaches 6.0*10-7Pa, mechanical stress 6.0*10-7Pa>tensile ...

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Abstract

The invention belongs to the technical field of electronic packaging, and relates to a hybrid integrated circuit tube shell. The hybrid integrated circuit tube shell comprises a tube shell side wall and a plurality of insulator mounting holes embedded in the tube shell side wall, wherein the insulator mounting holes are internally equipped with insulators; and the pressure-bearing end parts of thetube shell side wall are respectively provided with elastic stress strips. The method for preventing a glass insulator from breaking comprises the steps of arranging elastic stress strips at the pressure-bearing end parts of the tube shell side wall of the circuit tube shell, pressing the pressure-bearing end parts of the tube shell side wall to a circuit board provided with the circuit tube shell when the circuit tube shell is installed, and enabling the elastic stress strips to generate elastic deformation and bear elastic stress; and maintaining the elastic stress of the elastic stress trips and packaging the circuit tube shell. The method can protect the glass insulator from being broken due to the deformation of the tube shell side wall while not reducing the internal space of the integrated circuit tube shell, and has the advantages of low operating and processing difficulty and obvious effect.

Description

technical field [0001] The invention belongs to the technical field of electronic packaging, and relates to a hybrid integrated circuit shell and a method for preventing glass insulators from breaking. Background technique [0002] The integrated circuit shell is an important part of the hybrid integrated circuit. It mainly plays the role of circuit support, electrical signal transmission, heat dissipation, sealing and protection. The shallow-cavity integrated circuit shell is the most commonly used shell type for hybrid integrated circuits. Nearly With the continuous improvement of circuit density in recent years, circuit design has put forward higher requirements for shallow-cavity integrated circuit shells, but the traditional shell structure design is difficult to meet the requirements of circuit design. The main problems are as follows: In order to increase circuit density, The circuit design needs to lay more circuits inside the shell under the condition of constant le...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/04H01B17/00H01B17/38
CPCH01B17/005H01B17/38H01L23/04
Inventor 董进
Owner 西安伟京电子制造有限公司
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