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Wafer post-processing system and method

A post-processing and wafer technology, applied in the manufacture of electrical components, circuits, semiconductors/solid-state devices, etc., can solve problems such as water marks, poor wafer drying effect, easy residual liquid, etc., to reduce liquid residue and improve drying effect , to achieve the effect of cleaning and drying

Pending Publication Date: 2019-10-25
TSINGHUA UNIV +1
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The traditional spin drying method, due to the large thickness of the remaining water film after drying, may even be higher than 200nm, which can easily cause water mark defects
[0006] To sum up, in the prior art, there are problems of poor wafer drying effect and easy residual liquid

Method used

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  • Wafer post-processing system and method
  • Wafer post-processing system and method
  • Wafer post-processing system and method

Examples

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Embodiment Construction

[0046] The technical solutions of the present invention will be described in detail below in conjunction with specific embodiments and accompanying drawings. The examples described here are specific implementations of the present invention and are used to illustrate the concept of the present invention; these descriptions are all explanatory and exemplary, and should not be construed as limiting the implementation of the present invention and the protection scope of the present invention . In addition to the embodiments described here, those skilled in the art can also adopt other obvious technical solutions based on the claims of the application and the contents disclosed in the specification, and these technical solutions include adopting any modifications made to the embodiments described here. Obvious alternatives and modified technical solutions. It should be understood that, unless otherwise specified, for ease of understanding, the following descriptions of the specifi...

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Abstract

The invention relates to the technical field of chemical mechanical polishing post-processing, and discloses a wafer post-processing system and method, and the system comprises a wafer lifting devicewhich is used for lifting a wafer immersed in a cleaning solution from the cleaning solution; a gas spraying device which is used for spraying dry gas at first temperature to a meniscus area of the cleaning liquid attached to the surface of the wafer in the process that the wafer is lifted from the cleaning liquid, so that attachments on the surface of the wafer are stripped from the surface of the wafer in the direction opposite to the lifting direction; and a liquid level monitoring device which is connected with the gas injection device and is used for detecting the position of the meniscusarea, so as to enable the dry gas injected by the gas injection device to be aligned with the meniscus three-phase contact line area.

Description

technical field [0001] The invention relates to the technical field of chemical mechanical polishing post-processing, in particular to a wafer post-processing system and method. Background technique [0002] Chemical Mechanical Planarization (CMP) is an ultra-precision surface processing technology for global planarization in integrated circuit (IC) manufacturing. With the development of integrated circuit manufacturing technology, the control of wafer surface defects is becoming more and more stringent. During the wafer manufacturing process, the surface of the wafer will absorb pollutants such as particles or organic matter to generate a large number of defects, which require post-processing to remove these defects. [0003] In particular, chemical reagents and abrasives used in large quantities in chemical mechanical polishing will cause contamination on the wafer surface, so after polishing, a post-treatment process is required to remove the contaminants on the wafer su...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67H01L21/02
CPCH01L21/67011H01L21/67242H01L21/67253H01L21/02H01L21/02041H01L21/67017
Inventor 李长坤赵德文魏聪王同庆路新春
Owner TSINGHUA UNIV
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