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Copper-clad ceramic substrate motherboard structure

A technology for copper-clad ceramic substrates and motherboards, used in semiconductor/solid-state device parts, semiconductor devices, electrical components, etc., can solve the problems of cracking, fragile edges, and cracks on the motherboard, reducing damage and increasing strength. , the effect of reducing the risk of fracture

Pending Publication Date: 2019-10-25
上海富乐华半导体科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Aiming at the problems existing in the prior art, the present invention provides a copper-clad ceramic substrate motherboard structure to solve the problem that the edge of the existing traditional motherboard is easily damaged and cracks, and also solves the traditional , the technical problem that the mother board is easy to crack along the cutting line

Method used

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  • Copper-clad ceramic substrate motherboard structure
  • Copper-clad ceramic substrate motherboard structure
  • Copper-clad ceramic substrate motherboard structure

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specific Embodiment 1

[0031] Specific embodiment 1: see Figure 1 to Figure 3 , a copper-clad ceramic substrate motherboard structure, including a motherboard 2, the front or back of the motherboard 2 is also engraved with criss-crossing cutting lines, and the outer sides of the motherboard 2 are provided with corresponding reinforcement Copper foil process edge; reinforced copper foil process edge includes four copper foil edges 1 respectively arranged on the upper, lower, left, and right sides outside the motherboard; the cutting line includes copper foil edges 1 for upper and lower settings on the motherboard. The separated transverse cutting line L and the longitudinal cutting line M for the left and right copper foil edges 1 set on the motherboard are separated from the motherboard, and the two ends of the transverse cutting line L protrude from the longitudinal cutting line to the outer edge of the motherboard. but still on the inside of the adjacent foil edge. There are two transverse cutti...

specific Embodiment 2

[0042] Specific embodiment 2, see Figure 4 , the upper and lower ends of the longitudinal cutting line M extend to the outer edge of the motherboard.

[0043] The separation sequence in the later stage of this structure is as follows: First, the left copper foil edge A1 and the right copper foil edge A2 are vertically separated along the longitudinal cutting line M, and then the upper copper foil edge B1 and the lower copper foil edge B1 are separated along the transverse cutting line L. Side B2 is split apart laterally.

specific Embodiment 3

[0044] Specific embodiment 3, see Figure 5 as well as Figure 6 , On the basis of specific embodiment 1 or 2, at least one of the four corners of the motherboard is a chamfered structure. Through the chamfer structure, the positioning or fool-proofing of the mother board is realized. The angle of the chamfer structure is 10°-80°. The four corners of the motherboard can be inverted with 1 to 4 bevels. Figure 6 Middle (A) is a schematic diagram of chamfering a corner. (B) is a schematic diagram of chamfering two corners. (C) is a schematic diagram of chamfering three corners. (D) is a schematic diagram of chamfering four corners. The edge of the aluminum foil adjacent to the chamfer structure is also a chamfer structure.

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Abstract

The invention provides a copper-clad ceramic substrate motherboard structure, which includes a motherboard. The front or back of the motherboard is engraved with cutting lines. Corresponding reinforced copper foil process edges are arranged on the outer sides of the obverse and reverse sides of the motherboard. The reinforced copper foil process edges include upper, lower, left and right copper foil process edges. The cutting lines include transverse cutting lines and longitudinal cutting lines for breaking the copper foil process edges on the motherboard off the motherboard, and the two endsof the transverse cutting lines or of the longitudinal cutting lines extend to the outer edge of the motherboard. The cutting lines also include mesh internal cutting lines for breaking single small substrates off the motherboard, and the transverse cutting lines or of the longitudinal cutting lines extend from the upper, lower, left and right four directions of the mesh internal cutting lines. Through the corresponding reinforced copper foil process edges, the strength of the edge of the motherboard is increased, and the damage and cracks of the ceramic edge of the motherboard are reduced.

Description

technical field [0001] The invention relates to the technical field of semiconductor processing equipment, in particular to a mother board of a copper-clad ceramic substrate. Background technique [0002] Copper-clad ceramic substrate (DBC substrate), referred to as ceramic copper-clad laminate. Copper-clad ceramic substrates are graphic circuit boards manufactured by motherboards, and are often used as power device substrates in the field of electronic packaging. [0003] In order to improve the production efficiency of power device packaging, the current welding process of components such as DBC substrates and chips is gradually changing from small piece welding to overall motherboard welding, and then divided into small pieces after welding. However, since the base material of the motherboard is ceramic, and it has been laser cut before delivery (with cutting lines on the surface), there are many problems in production: [0004] 1) Ceramics at the edge of the motherboar...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/492H01L23/13H01L23/15
CPCH01L23/492H01L23/13H01L23/15
Inventor 戴洪兴贺贤汉周轶靓王斌阳强俊陈天华
Owner 上海富乐华半导体科技有限公司
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