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Transfer and Die Carriers

A carrier board and grain technology, applied in the direction of semiconductor devices, electrical components, circuits, etc., can solve the problem of inability to accurately align the transfer carrier board

Active Publication Date: 2021-09-14
PLAYNITRIDE
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The present invention is to provide a transfer carrier and a die carrier to solve the problem that the transfer carrier cannot be precisely aligned due to thermal expansion.

Method used

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  • Transfer and Die Carriers
  • Transfer and Die Carriers
  • Transfer and Die Carriers

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Embodiment Construction

[0053] The detailed features and advantages of the present invention are described in detail below in the embodiments, which are sufficient to enable those skilled in the art to understand the technical content of the present invention and implement it accordingly, and according to the contents disclosed in this specification, claims and accompanying drawings , those skilled in the art can easily understand the related objects and advantages of the present invention. The following examples are to further describe the viewpoints of the present invention in detail, but not to limit the scope of the present invention in any way.

[0054] The transfer carrier illustrated according to the embodiments of the present invention can be used to transfer a plurality of micro devices on a first substrate to a second substrate. Wherein, the first substrate is, for example, an epitaxial substrate, on which micro components such as micro LEDs (micro LEDs) are formed, and the second substrate...

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Abstract

The invention discloses a transfer carrier plate, which is used for transferring a plurality of micro components on a first substrate to a second substrate. The transfer carrier includes a substrate and a plurality of transfer parts. The transfer elements are spaced apart on an upper surface of the substrate. Each transfer member has a first surface and a second surface opposite to each other. The transfer elements contact the substrate with the first surface. Wherein, the thermal expansion coefficient of the substrate is different from the thermal expansion coefficient of the transfer parts, and the difference between the thermal expansion coefficient of the transfer parts and the thermal expansion coefficient of the micro components is smaller than the thermal expansion coefficient of the substrate and the thermal expansion coefficients of the transfer parts difference. The invention also discloses a grain carrier board.

Description

technical field [0001] The invention relates to a transfer carrier and a grain carrier, in particular to a transfer carrier and a grain carrier with surface microstructures. Background technique [0002] Light emitting diodes (light emitting diodes, LEDs), as high-efficiency light emitting elements, are widely used in various fields. Currently, the existing manufacturing method of light-emitting devices is to sequentially form an N-type semiconductor layer, a light-emitting layer, a P-type semiconductor layer and electrodes on an epitaxial substrate by means of epitaxy, thereby obtaining a light-emitting device. [0003] When the size of the light-emitting element is reduced to the micrometer (micrometer, μm) level to form a micro-light-emitting element and applied to a display device, a micro-light-emitting element array composed of many micro-light-emitting elements is arranged on the display panel as a light source for the display device. However, the usual method of man...

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/683H01L33/00
CPCH01L21/6835H01L33/00H01L2221/68304
Inventor 赖育弘林子旸李允立
Owner PLAYNITRIDE