LED lamp strip circuit board

Abstract

The invention discloses an LED lamp strip circuit board. The LED lamp strip circuit board structurally comprises a first insulating layer, a first metal layer, a second insulating layer and a second metal layer from top to bottom. The first insulating layer is a PET thin film layer or a polyimide thin film layer or an ink layer. The second insulating layer is a PET thin film layer or a polyimide thin film layer. The thickness of the first metal layer ranges from 12 micrometers to 18 micrometers, and the thickness of the second metal layer ranges from 18 micrometers to 35 micrometers. The LED lamp strip circuit board has the advantages of high production efficiency, environmental protection and low production cost. Not only the thickness of the circuit board is reduced, but also the servicelife of the product is prolonged.

Description

technical field [0001] The invention relates to the field of circuit boards, in particular to an LED lamp strip circuit board. Background technique [0002] At present, LED light strips generally use LEDs assembled on a strip-shaped FPC (flexible circuit board) or LED wire board. However, the production process of the currently known traditional etching ink flexible circuit board requires cutting, drilling, wiring, exposure, green oil, etching, printing, electrical measurement, etc. The production process is complicated and the cost is high. The production process that needs to pollute the environment such as electroplating, etching, pickling and drilling is not environmentally friendly, and the production efficiency of splicing and cutting is extremely low, about 3 meters per minute. [0003] Another process wire board is similar to traditional cables in the production process. Although there is no need for electroplating, etching, pickling and drilling, it needs to press ...

AI Technical Summary

Problems solved by technology

However, the production process of the known traditional etching ink flexible circuit boards needs to go through board cutting, drilling, wiring, exposure, green oil, etching, printing, electrical testing, etc. The production process is complicated and the cost is high.

The production process that pollutes the environment such as electroplating, etching, pickling and drilling is not environmentally friendly, and requires splicing and cutting. The production efficiency is extremely low, and the production rate is about 3 meters per minute.

[0003] The other process wire plate is similar to traditional cables in the production process. Although it does not require electroplating, etching, pickling and drilling processes, it needs to press flat copper strips and then press for production. The production process is expensive. The accuracy is poor, the production capacity is extremely low (0.8 meters per minute for the metal stamping die), and the process is unstable. The copper wire is easy to shift. Risk of conduction due to breakdown

In response to the above problems, the Chinese invention patent with the authorized announcement number CN104953011B discloses a substrate with a metal layer and its manufacturing method. Continuous roll production is realized through a multi-layer thin film substrate and metal layer. The process is greatly optimized and the cost is reduced. The production process is stable, and the cost performance of the product is greatly improved. However, the multilayer film substrate and the metal layer need to be connected by adhesive bonding, which requires high cost and bonding stability of the film substrate.

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