Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Methods and systems for inline parts average testing and latent reliability defect detection

A technology of average testing and reliability, applied in registration/indicating quality control system, semiconductor/solid-state device testing/measurement, measuring electricity, etc., can solve problems such as reliability failures

Active Publication Date: 2019-11-05
KLA CORP
View PDF4 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Some of these can later go on to cause early reliability failures of the device after exposure to its operating environment

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Methods and systems for inline parts average testing and latent reliability defect detection
  • Methods and systems for inline parts average testing and latent reliability defect detection
  • Methods and systems for inline parts average testing and latent reliability defect detection

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0016] Reference will now be made in detail to the disclosed subject matter which is illustrated in the accompanying drawings.

[0017] Embodiments of the present invention are directed to methods and systems for in-line partial averaging testing and potential reliability defect identification and / or detection. A latent reliability defect refers to a defect from manufacturing present in a device that passes initial quality testing but still results in premature failure when activated in its operating environment. For example, wafers can be fabricated and used to produce various types of semiconductor electronic components. These semiconductor electronic components can then be used in the field for various purposes (e.g., they can be incorporated into automobiles or other types of vehicles that require high reliability or low field failure rates, aircraft, military, medical, and other devices) and Operates in various types of environments. Some of these semiconductor electron...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

Methods and systems for inline parts average testing and latent reliability defect recognition or detection are disclosed. An inline parts average testing method may include: performing inline inspection and metrology on a plurality of wafers at a plurality of critical steps during wafer fabrication; aggregating inspection results obtained from inline inspection and metrology utilizing one or moreprocessors to obtain a plurality of aggregated inspection results for the plurality of wafers; identifying one or more statistical outliers among the plurality of wafers at least partially based on the plurality of aggregated inspection results obtained for the plurality of wafers; and disqualifying the one or more statistical outliers from entering a supply chain for a downstream manufacturing process, or segregating the one or more statistical outliers for further evaluation, testing or repurposing.

Description

[0001] Related Application Cross Reference [0002] This application claims the benefit of U.S. Provisional Application No. 62 / 475,749, filed March 23, 2017, under 35 U.S.C. § 119(e). Said US Provisional Application No. 62 / 475,749 is hereby incorporated by reference in its entirety. technical field [0003] The present invention relates generally to the field of process control, and in particular to inspection and metrology of semiconductor devices. Background technique [0004] Thin polished plates such as silicon wafers and the like are an extremely important part of modern technology. For example, a wafer may refer to a thin sheet of semiconductor material used in the fabrication of integrated circuits and other devices. Other examples of thin polished plates may include magnetic disk substrates, gauge blocks, and the like. Although the techniques described here refer primarily to wafers, it should be understood that the techniques are also applicable to other types o...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/66
CPCG01R31/2831G01R31/2894Y02P90/02H01L22/12H01L22/30H01L22/24H01L22/26G07C3/14G01R31/2601G06F17/18
Inventor D·W·普利斯R·J·拉瑟R·卡佩尔K·L·榭曼D·G·苏瑟兰
Owner KLA CORP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products