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A kind of epoxy resin bonding composition for multilayer flexible circuit board, preparation method and adhesive film

A flexible circuit board, epoxy resin technology, applied in the direction of epoxy resin glue, film/sheet adhesive, adhesive type, etc., can solve the problems of poor operation, low initial viscosity, and high initial viscosity , to achieve the effect of improving production efficiency and product yield, and easy operation

Active Publication Date: 2021-06-04
ZHONGSHAN DONGYI HIGH TECH MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] In order to solve the problems of high initial viscosity, poor operation and low efficiency in the prior art, one of the purposes of the embodiments of the present invention is to provide an epoxy resin for multilayer flexible circuit boards Adhesive composition. The epoxy resin adhesive composition has low initial viscosity and is easy to operate. During the production process, a fast press is used to press it without abnormal appearance such as "fish scale" flow glue and uneven appearance, which can effectively improve production efficiency and product yield.

Method used

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  • A kind of epoxy resin bonding composition for multilayer flexible circuit board, preparation method and adhesive film
  • A kind of epoxy resin bonding composition for multilayer flexible circuit board, preparation method and adhesive film

Examples

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Embodiment 1

[0044]An epoxy resin bonding composition for multilayer flexible circuit boards, comprising the following raw materials in parts by weight:

[0045] 15 parts of high molecular weight epoxy resin, 40 parts of low water absorption epoxy resin, 18 parts of high molecular weight end carboxyl nitrile rubber, 12 parts of low molecular weight end carboxyl nitrile rubber, 12 parts of fumed silica, 3 parts of curing agent.

[0046] In the above formula, the high molecular weight epoxy resin is JER1256 high molecular weight epoxy resin, the low water absorption epoxy resin is XD-1000 epoxy resin, and the curing agent is 4,4-diaminodiphenyl sulfone.

Embodiment 2

[0048] An epoxy resin bonding composition for multilayer flexible circuit boards, comprising the following raw materials in parts by weight:

[0049] 15 parts of high molecular weight epoxy resin, 40 parts of low water absorption epoxy resin, 21 parts of high molecular weight end carboxyl nitrile rubber, 9 parts of low molecular weight end carboxyl nitrile rubber, 12 parts of fumed silica, 3 parts of curing agent.

[0050] In the above formula, the high molecular weight epoxy resin is JER1256 high molecular weight epoxy resin, the low water absorption epoxy resin is XD-1000 epoxy resin, and the curing agent is 4,4-diaminodiphenyl sulfone.

Embodiment 3

[0052] An epoxy resin bonding composition for multilayer flexible circuit boards, comprising the following raw materials in parts by weight:

[0053] 10 parts of high molecular weight epoxy resin, 45 parts of low water absorption epoxy resin, 18 parts of high molecular weight end carboxyl nitrile rubber, 12 parts of low molecular weight end carboxyl nitrile rubber, 12 parts of fumed silica, 3 parts of curing agent.

[0054] In the above formula, the high molecular weight epoxy resin is JER1256 high molecular weight epoxy resin, the low water absorption epoxy resin is XD-1000 epoxy resin, and the curing agent is 4,4-diaminodiphenyl sulfone.

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Abstract

Embodiments of the present invention provide an epoxy resin adhesive composition for multilayer flexible circuit boards, a preparation method, and an adhesive film. The epoxy resin adhesive composition has low initial tack, is easy to operate, and uses There is no abnormal appearance such as "fish scales" in the pressing of the fast press, which can effectively improve production efficiency and product yield.

Description

technical field [0001] The invention belongs to the technical field of adhesives, and in particular relates to an epoxy resin adhesive composition for multilayer flexible circuit boards, a preparation method and an adhesive film. Background technique [0002] The layers of the multilayer flexible printed circuit board are bonded by epoxy resin composition. [0003] Epoxy resin, Epoxy Resin, referred to as EP, refers to a linear polymer compound containing two or more epoxy groups in the molecule, usually in the form of a low-viscosity liquid or viscous liquid, and a few in the form of a solid state exists. Epoxy resins have higher strength, stiffness and better creep, heat and solvent resistance than most thermoplastic materials. In addition, epoxies shrink less than other unsaturated polyesters and require less manufacturing pressure than other thermoset resins. Epoxy resins of various viscosities are available on the market, from low-viscosity liquid to high-viscosity v...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J163/00C09J11/04C09J7/30C09J7/10C08G59/50
CPCC08G59/504C08L2201/08C08L2205/025C08L2205/035C08L2205/06C09J11/04C09J163/00C09J2203/326C09J2463/00C09J7/10C09J7/30C09J2301/408C08L63/00C08L13/00C08K7/26
Inventor 陈建平张正浩
Owner ZHONGSHAN DONGYI HIGH TECH MATERIAL