High-speed signal impedance hole, and circuit board and manufacturing method thereof
A technology of high-speed signal and production method, which is applied in the direction of printed circuit manufacturing, printed circuit, printed circuit, etc., can solve the problems such as the difficulty of hole impedance design value, realize the function of circuit connection and device installation, increase production cost, and meet high density The effect of circuit design
Inactive Publication Date: 2019-11-08
珠海崇达电路技术有限公司 +1
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- Application Information
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Problems solved by technology
However, in actual production, due to the high density of circuit design and the refinement of devices, it is sometimes impossible to adjust the required impedance value by increasing the size of the anti-pad or pad, or directly reducing the aperture of the impedance hole. There are great difficulties in the design value of the hole impedance of the product
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Embodiment
[0023] This embodiment provides a method for manufacturing a circuit board, including making two types of impedance holes on the circuit board, the first impedance hole is composed of a fixed section and a resistance adjustment section, such as figure 1 As shown, the second impedance hole is composed of a copper-free section, a fixed aperture section and a resistance adjustment section, such as figure 2 shown; and the line density of the line layer area penetrated by the resistance adjusting section is greater than the line density of the line layer area penetrated by the aperture fixed section. The aperture fixing section of this embodiment will also be used for installing devices, so the aperture of the aperture fixing section is set according to the requirements of the device to be installed, so that it can meet the installation of the device to be installed. The length of the aperture fixing section is equal to the length of the crimping pin of the device to be installed....
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The invention relates to the technical field of circuit board production and manufacturing, in particular to a high-speed signal impedance hole, a circuit board and a manufacturing method thereof. Animpedance hole is designed to an aperture fixing section and a resistance adjusting section, the aperture of the aperture fixing section is determined according to the design requirement of a product,and then the aperture size of the resistance adjusting section is adjusted to enable the total impedance of the impedance hole to meet the design requirement, so that the strict requirement of the product on the aperture can be met through the aperture fixing section, the circuit connection and device installation functions are achieved, and the total impedance of the impedance hole can be ensured to meet the design requirement through the resistance adjusting section. In addition, the resistance adjusting section is arranged among the circuit layers with the larger circuit density, and the aperture size of the resistance adjusting sections is adjustable, so that the design mode of the impedance hole has the lower requirement on layout space, and the circuit space of the circuit board canbe fully utilized. The impedance hole is arranged on the circuit board, so that the high-density circuit design can be met, the mounting and interconnection functions of the device can be achieved, and the production cost is hardly increased.
Description
technical field [0001] The invention relates to the technical field of circuit board production and manufacturing, in particular to a high-speed signal impedance hole, a circuit board and a manufacturing method. Background technique [0002] With the continuous improvement of the integration of electronic systems, circuit boards are becoming more and more integrated and functional, so it is inevitable that the design density of PCB will become higher and higher. With the increasing application of high-speed interconnection, the requirements for high-speed signals of products will become higher and higher, such as high-performance computing and big data. As the application of high-frequency and high-speed products has been greatly improved, new requirements have been placed on the integrity of high-speed digital signals. [0003] In the case of high frequency and high speed, the transmission lines of high-speed circuits have high requirements on signal problems such as cross...
Claims
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IPC IPC(8): H05K1/02H05K1/11H05K3/00H05K3/42
CPCH05K1/0251H05K1/116H05K3/0047H05K3/42H05K2201/095
Inventor 袁为群彭卫红宋建远翟青霞
Owner 珠海崇达电路技术有限公司