Thermal superconducting plate and thermal superconducting heat sink

A thermal superconductivity and radiator technology, applied in the field of heat transfer, can solve problems such as equipment not working properly, plate-fin radiator failure, heat transfer working medium leakage, etc., to prevent equipment from working normally, ensure heat dissipation performance, ensure performance effect
CN110430724APending Publication Date: 2019-11-08ZHEJIANG JIAXI TECH CO LTD
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Patent Information

Authority / Receiving Office
CN Β· China
Current Assignee / Owner
ZHEJIANG JIAXI TECH CO LTD
Publication Date
2019-11-08

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Abstract

The invention provides a thermal superconducting plate and a thermal superconducting heat sink. A plurality of mutually independent closed cavities is formed in the thermal superconducting plate, andeach of the closed cavities is extended from one side of the thermal superconducting plate to the opposite side, and is internally provided with a thermal superconducting heat transfer channel which is filled with a heat transfer working medium. The thermal superconducting plate is internally provided with a plurality of mutually independent closed cavities to form a plurality of mutually independent thermal superconducting heat transfer channels, even though one thermal superconducting heat transfer channel generates the problem of leakage of the heat transfer working medium, the normal heatdissipation of the other thermal superconducting heat transfer channels cannot be influenced, the heat dissipation performance of the thermal superconducting plate is ensured, and the reliability of the thermal superconducting plate is improved.
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Description

technical field

[0001] The invention belongs to the technical field of heat transfer, in particular to a thermal superconducting plate and a thermal superconducting radiator. Background technique

[0002] With the rapid development of power electronics technology, the integration of power components is getting higher and higher, the power density is also increasing, and the heat generated by itself during work is also increasing. The removal of heat will cause the temperature of the chip in the power device to rise, which will cause a decrease in performance and shorten the service life, and will cause the failure of the power device and the burning of the chip; an efficient and reliable heat sink is to ensure the reliability of these power devices. important part of running.

[0003] Existing plate-fin radiators are generally stacked and brazed with thermal superconducting plates to form a plate-fin heat sink, and then welded to the processed substrate by argon arc welding...

Claims

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