High-frequency shearing light curing three-dimensional forming device and method

A three-dimensional forming and photocuring technology, applied in the directions of additive manufacturing, processing and manufacturing, and auxiliary operation of additional layers, etc., can solve the problems of high cost of the bottom plane of the liquid tank, less types of photosensitive resins, and reduced peeling speed, etc. High frequency stability, no peeling damage, and the effect of flat peeling damage

Pending Publication Date: 2019-11-12
杭州德迪智能科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Rigid forced peeling means that the cured product is forcibly pulled away from the rigid bottom plane of the liquid tank by mechanical pulling force. The peeling speed is fast, but the peeling force and peeling damage are also the largest; flexible film peeling means that the bottom of the liquid tank is made of a flexible film, and the mechanical force will When the cured product is pulled away from the bottom plane of the liquid tank, the flexible film undergoes elastic deformation, so that the peeled area gradually spreads from the outer edge of the cured product to the complete section, and the peeling force and peeling damage are reduced compared with rigid forced peeling. The speed is greatly reduced, which is the most commonly used peeling method; peel-free refers to adding a special lyophobic structure or coating on the bottom surface of the liquid tank to prevent the bottom of the liquid tank from bonding with the cured product during the photo-curing reaction, so that there is no need to After the curing reaction, the cured product is mechanically peeled off from the bottom plane of the liquid tank, which significantly improves the efficiency of photocuring three-dimensional forming, but there are still limitations such as few types of photosensitive resins that can be matched, high cost of the bottom plane of the liquid tank, and short service life.
At present, in the field of photo-curing three-dimensional forming, in order to further improve the forming accuracy and efficiency of lower liquid surface photo-curing equipment, there is still a lack of a light-curing device with simple structure, low cost, and effective solution to the problem of bonding between the cured product and the bottom plane of the liquid tank. solidified three-dimensional forming method

Method used

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  • High-frequency shearing light curing three-dimensional forming device and method
  • High-frequency shearing light curing three-dimensional forming device and method
  • High-frequency shearing light curing three-dimensional forming device and method

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Embodiment

[0025] A high-frequency shear light curing three-dimensional forming device, such as figure 1 , 2, there is a liquid tank 2 in the rigid frame 1, and there is a photosensitive polymer material 3 in the liquid tank 2, and the opening of the liquid tank 2 is fitted on the top plate 4 of the rigid frame 1; there is an elastic guide rail 5 at the bottom of the rigid frame 2, and the movement of the elastic guide rail 5 The platform is connected to the bottom of the liquid tank 2; the inner surface of the rigid frame 2 has a high-frequency vibrator 6, and the actuating rod of the high-frequency vibrator 6 is connected to the bottom side of the liquid tank 2; the bottom of the rigid frame 2 has an imaging element 7, and the imaging element 7 can The optical pattern is projected onto the bottom of the liquid tank 2, and after the optical pattern penetrates the bottom of the liquid tank 2, it exposes the photosensitive polymer material 3 on the liquid surface under the liquid tank 2; ...

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Abstract

The invention relates to a high-frequency shearing light curing three-dimensional forming device and method. The device comprises a rigid frame internally provided with a liquid groove. An opening ofthe liquid groove and a top plate of the rigid frame are arranged in a nested manner. A Z-direction linear module is arranged on the top plate of the rigid frame. A moving platform of the Z-directionlinear module and a forming base plate are connected, the forming base plate can be driven to vertically move in the liquid groove and to be positioned, and the bottom of the rigid frame is provided with an imaging element capable of projecting an optical pattern to the transparent bottom of the liquid groove. An elastic guide rail is arranged at the bottom of the rigid frame, a moving platform ofthe elastic guide rail is connected with the bottom of the liquid groove, and a high-frequency vibrator is arranged on the inner side face of the rigid frame and is connected with the bottom side edge of the liquid groove. According to the high-frequency shearing light curing three-dimensional forming device and method, the structure is simple, cost is low, and the problem about cured object andliquid groove bottom plane bonding can be effectively solved.

Description

technical field [0001] The invention relates to the field of three-dimensional printing, in particular to a high-frequency shear light curing three-dimensional forming device and method. Background technique [0002] Photocuring three-dimensional forming technology is one of the important means to quickly and directly produce polymer parts, or indirectly produce metal parts through investment casting. Compared with technologies such as melt extrusion molding (FDM) and selective laser sintering (SLS), Stereo-curing three-dimensional forming not only has smooth forming surface and fast forming speed, but also has simple equipment structure and low cost, which plays an important role in the field of additive manufacturing. Among the light-curing three-dimensional forming equipment with various structural forms, the lower liquid surface light-curing equipment is one of the most widely used types, that is, the optical pattern penetrates the transparent bottom of the photosensitiv...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B29C64/129B29C64/188B33Y30/00
CPCB29C64/129B29C64/188B33Y30/00
Inventor 俞红祥王康恒应华
Owner 杭州德迪智能科技有限公司
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