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Method for Testing Thin Film Encapsulation Performance

A thin-film encapsulation and performance technology, applied in the application field, can solve the problem of inability to fully test the performance of thin-film encapsulation, and achieve the effect of an efficient detection method

Active Publication Date: 2020-07-10
WUHAN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] In order to solve the above problems, the embodiment of the present invention provides a method for testing the performance of thin film packaging, which can effectively solve the problem that the performance of thin film packaging cannot be fully tested

Method used

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  • Method for Testing Thin Film Encapsulation Performance
  • Method for Testing Thin Film Encapsulation Performance
  • Method for Testing Thin Film Encapsulation Performance

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Embodiment Construction

[0030] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some of the embodiments of the present invention, not all of them. Based on The embodiments of the present invention, and all other embodiments obtained by those skilled in the art without creative efforts, all belong to the protection scope of the present invention.

[0031] In describing the present invention, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", " Orientation indicated by rear, left, right, vertical, horizontal, top, bottom, inside, outside, clockwise, counterclockwise, etc. The positional relationship is based on the orientation or positional relationship shown in the drawings, which is only for the convenience of descr...

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Abstract

A method for testing thin film encapsulation performance, which comprises the steps of: step S100, providing a test cavity (10); step S110, depositing a first film layer (4) at the bottom of the test cavity (10), and setting the middle of the first film layer (4) to be hollow; step S120, depositing a second film layer (5) at the middle of the first film layer (4), and covering part of the second film layer (5) on the first film layer (4), the coating area of the second film layer (5) being smaller than the coating area of the first film layer (4), and the second film layer (5) being separated from a sidewall (2) of the test cavity (10); and step S130, obtaining a lateral water and oxygen blocking value of the second film layer (5) by means of a detector (3), and setting the lateral water and oxygen blocking value to be a first value. Different film layers are combined and designed to form various lateral vapor intrusion paths of a thin film or encapsulation structure, so that the lateral water and oxygen blocking capability of the thin film can be detected, and thus an efficient detection means is provided for display panel encapsulation.

Description

technical field [0001] The invention relates to the field of application technology, in particular to a method for testing the performance of thin film packaging. Background technique [0002] With the development of display technology, flexible display devices have been widely used due to their advantages of light weight, thin thickness, bendability, and wide viewing angle range, while Organic Light-Emitting Diode (OLED) materials are sensitive to water Oxygen is very sensitive, and a small amount of water and oxygen intrusion will cause rapid attenuation of the device and affect the life of the OLED. In order to ensure the service life of the flexible display device, its packaging technology is particularly important. [0003] In order to realize the flexible display of the OLED, Thin-Film Encapsulation (TFE) is generally used to protect the OLED. The existing OLED thin film encapsulation (TFE) design generally adopts an organic / inorganic film layer stack structure to ach...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01N15/08
CPCG01N15/08G01N2015/086
Inventor 卢瑞夏存军
Owner WUHAN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
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