Method for processing workpiece

Abstract

The invention provides a method for processing a workpiece. According to the method, a plate like workpiece is processed by irradiating laser beams on the workpiece, and the generation of defects is prevented during the processing process. According to the processing method, a plate like workpiece with N predetermined cutting lines is processed, wherein N is a natural number greater than 3. The method comprises following steps: step one, irradiating laser beams on a first predetermined cutting line on a first position so as to form a processing mark on the workpiece, wherein the distance between the first position and the outermost predetermined cutting line of the workpiece is 2n*D, D is the distance between two neighbored first predetermined cutting lines and n is a maximal natural number and satisfies 2n<N; and step (k+1), irradiating a predetermined cutting line selected from a first predetermined cutting line on the (k+1)th position so as to form a processing mark on the work piece, wherein the distance between the (k+1)th position and a k-th position is 2n-k*D*m, and m is a natural number.

Description

technical field [0001] The present invention relates to a method of processing a workpiece, which processes a plate-shaped workpiece along a planned dividing line. Background technique [0002] The front surface of the wafer as the base material is divided into a plurality of regions by the planned dividing line called a divider, and devices such as integrated circuits are formed in each region, and then the wafer is divided along the planned dividing line, so that the assembly in the Device chips for various electronic devices. For dividing a wafer, for example, a cutting device that rotates a ring-shaped cutting blade to cut into a target is used. [0003] In cutting processing of a wafer using this cutting device, the wafer is mechanically cut by a rotating cutting blade. Therefore, for example, when the loads acting on the wafer from one side (front) and the other side (back) of the cutting tool vary, machining defects such as chips or cracks tend to occur on the wafer...

AI Technical Summary

Problems solved by technology

[0008] However, when a wafer is processed by the above-mentioned method using a laser processing device, processing defects such as chips and cracks may sometimes occur on the wafer.

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