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Sharpening plate and sharpening method of cutting tool

A cutting tool and cutting device technology, applied in the field of sharpening plates, can solve the problems of protruding abrasive particles and the quality of device chips, and achieve the effects of preventing excessive sharpening, alleviating wear, and inhibiting poor processing

Pending Publication Date: 2021-02-09
DISCO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, if the cutting tool is cut into the sharpening plate, the bonding material is severely worn at the front end of the cutting tool, and the abrasive grains tend to protrude excessively from the bonding material.
Moreover, if the wafer is cut with a cutting tool with a large protruding amount of abrasive grains, processing defects such as chipping (chipping) may occur on the wafer, and the quality of the device chip may deteriorate.

Method used

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  • Sharpening plate and sharpening method of cutting tool
  • Sharpening plate and sharpening method of cutting tool
  • Sharpening plate and sharpening method of cutting tool

Examples

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Embodiment Construction

[0021] Hereinafter, embodiments of the present invention will be described with reference to the drawings. First, a configuration example of a sharpening board according to the present embodiment will be described. The sharpening plate of this embodiment is used for sharpening (dressing) of an annular cutting tool for cutting a workpiece.

[0022] A cutting tool is a processing tool that cuts a workpiece by cutting into the workpiece, and is formed by fixing abrasive grains made of diamond or the like with a binder. For example, as a cutting tool, a plated hub tool having a cutting edge in which abrasive grains are fixed by nickel plating or the like, or a ring-shaped cutting edge in which abrasive grains are fixed by a bonding material made of metal, ceramics, resin, etc., is used. The cutter (washer cutter).

[0023] As an example of a workpiece cut by a cutting tool, for example, IC (Integrated Circuit: Integrated Circuit), LSI (Large Scale Integration: Large Scale Integ...

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Abstract

The invention provides a sharpening plate and a sharpening method of a cutting tool, which can inhibit the generation of processing defects. A sharpening plate for sharpening a cutting tool by cuttingthe cutting tool for cutting an object to be processed, the sharpening plate comprising: a substrate that does not contain abrasive grains; and a sharpening member that is provided on the substrate and contains abrasive grains, the substrate and the sharpening member being in contact with the cutting tool to abrade the cutting tool.

Description

technical field [0001] The present invention relates to a sharpening plate for sharpening a cutting tool for cutting a workpiece, and a method for sharpening a cutting tool using the same. Background technique [0002] In the manufacturing process of device chips, IC (Integrated Circuit: Integrated Circuit), LSI (Large Scale Integration: Large Scale integrated circuits) and other devices wafers. By dividing the wafer along planned dividing lines, a plurality of device chips each having a device is obtained. Device chips are installed in various electronic devices such as mobile phones and personal computers. [0003] A cutting device having a chuck table holding a wafer and a cutting unit cutting the wafer is used for dividing the wafer. A ring-shaped cutting blade for cutting a wafer is attached to a cutting unit of the cutting device. A cutting tool is formed, for example, by fixing abrasive grains made of diamond with a bonding material made of metal (see Patent Docum...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B53/00
CPCB24B53/00B24B53/12B24B53/07
Inventor 石井隆博坪井纱代
Owner DISCO CORP
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