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Substrate processing equipment

A processing device and substrate technology, applied in the direction of sustainable manufacturing/processing, electrical components, climate sustainability, etc., can solve problems such as increased glass surface deflection, processing residues, and increased changes in tool pressing force

Inactive Publication Date: 2016-08-10
MITSUBOSHI DIAMOND IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, since heat treatment is performed when forming a metal film (Mo film) on a glass substrate in the manufacture of a solar cell substrate, the warpage of the glass surface is often increased
[0007] In such a situation, if only the piston rod of the air cylinder is moved up and down as in the conventional device, the tool cannot sufficiently follow the deflection of the solar cell substrate, and the variation of the pressing force of the tool will increase
In this way, processing residues or damage to the substrate may cause processing defects.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

no. 1 Embodiment －

[0036] A perspective view of the appearance of the substrate processing apparatus according to the first embodiment of the present invention is shown in figure 1 .

[0037] [Overall structure of groove processing device]

[0038] This device includes a stage 1 on which a solar cell substrate (hereinafter simply referred to as “substrate”) W is mounted, a head 3 of a groove forming tool 2 , two cameras 4 , and two monitors 5 .

[0039] Carrier 1 can move along the horizontal plane figure 1 to move in the Y direction. In addition, the stage 1 can be rotated at any angle in the horizontal plane. Furthermore, in figure 1 In , the schematic appearance of the head 3 is shown, and the head 3 will be described later.

[0040] The head 3 can move in X and Y directions above the stage 1 by means of the moving support mechanism 6 . Furthermore, if figure 1 As shown, the X direction is a direction perpendicular to the Y direction in the horizontal plane. The mobile support mechani...

no. 2 Embodiment －

[0057] A second embodiment of the present invention is schematically shown in FIG. 3 . Fig. 3(a) is a front view of the head of the grooving device and its control block, and Fig. 3(b) is a side view. In addition, the parts other than the head part are the same as those shown in the first embodiment.

[0058] Like the first embodiment, the head 30 has a base 32 and a holder 33 which are movable in the X direction. Also, a motor 34 for driving the holder 33 in the vertical direction is provided in the head portion 30 .

[0059] The holder 33 has a holder body 35 , a tool mounting portion 36 supported vertically on the holder body 35 , an air cylinder 37 fixed to the holder body 35 , and a sensor 38 . The lower end of the piston rod of the air cylinder 37 is connected to the tool mounting part 36 . Moreover, the tool 2 is detachably attached to the lower part of the tool attachment part 36. As shown in FIG.

[0060] The sensor 38 detects the height of the surface of the subs...

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Abstract

The present invention can prevent processing deformity since it can calculate a warpage of a substrate surface exactly. Therefore, the substrate processing apparatus according to the present invention is an apparatus for machining the surface of the substrate. It comprises a table (1) as the substrate is placed on top of it, and a head (3), a motor (18), a sensor (19), and a control unit (24). A head (3) has a base (16) which can move relatively in a horizontal direction to the table (1) and a holder (17) that supports the base (16) to be freely lifted and is attached to a processing tool(2) of a front end, and the motor (18) can lift the holder (17) against the base (16). The sensor (19) may detect the height from the substrate surface, and the control unit (24) controls the height of the holder (17) by controlling a driving device of the motor (18) based on the results analyzed from the sensor (19).

Description

technical field [0001] The invention relates to a processing device for a substrate, in particular to a processing device for forming grooves in a thin film of a solar cell substrate. Background technique [0002] The solar cell substrate is manufactured by a method as shown in Patent Document 1, for example. In the manufacturing method described in Patent Document 1, a lower electrode film composed of a Mo film is formed on a substrate such as glass, and then divided into strips by forming grooves in the lower electrode film. Next, a compound semiconductor film including a chalcopyrite structure compound semiconductor film, such as a CIGS film, is formed on the lower electrode film. Then, a part of these semiconductor films is removed in stripes by grooving and divided into strips, and an upper electrode film is formed so as to cover these semiconductor films. Finally, a part of the upper electrode film was peeled off in stripes by grooving and divided into short strips. ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/304H01L31/04H01L21/66
CPCH01L21/67092H01L21/67253H01L22/12H01L22/32H01L31/022425Y02P70/50
Inventor 久保仁宏野崎正和高桥昌见
Owner MITSUBOSHI DIAMOND IND CO LTD
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