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Laser beam adjustment system and laser processing apparatus

An adjustment mechanism and beam adjustment technology, which is applied to laser welding equipment, metal processing equipment, manufacturing tools, etc., can solve the problems that the operator is difficult to notice, and the laser beam adjustment takes time and effort

Pending Publication Date: 2021-06-08
DISCO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, adjustment of the laser beam by the beam expander takes labor and time
[0008] In addition, since parallel light adjustment and beam diameter adjustment using a photoreceptor are performed before processing, it is difficult for the operator to notice that the laser beam is no longer parallel or the beam diameter changes during processing.

Method used

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  • Laser beam adjustment system and laser processing apparatus
  • Laser beam adjustment system and laser processing apparatus
  • Laser beam adjustment system and laser processing apparatus

Examples

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Embodiment Construction

[0025] figure 1 The laser processing apparatus 10 shown is an apparatus for performing laser processing on a wafer 1 . The laser processing device 10 has: a cuboid base 11; a vertical wall portion 13, which is erected at one end of the base 11; a notification unit 50, which notifies the operator; and a control unit 51, which controls the laser processing device 10. Each component is controlled.

[0026] A chuck table moving mechanism 14 for moving the chuck table 43 is provided on the upper surface of the base 11 . The chuck table moving mechanism 14 performs processing feed of the chuck table 43 along the X-axis direction, and performs index feed along the Y-axis direction. The chuck table moving mechanism 14 has: a chuck table section 40 having a chuck table 43; relatively moving along the indexing feed direction; and a processing feed mechanism 30 that relatively moves the chuck table 43 relative to the laser processing unit 12 along the processing feed direction.

[00...

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PUM

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Abstract

The invention provides a laser beam adjustment system and a laser processing device, which can easily adjust a laser beam. The laser beam adjustment system for adjusting a laser beam to a parallel light. The system includes a beam adjustment unit having a plurality of lenses arranged in an optical path of the laser beam and, first and second mirrors that reflect the laser beam having passed through the beam adjustment unit, first and second cameras configured to capture images of a first light having passed through the first mirror and a second light having passed through the second mirror, calculation sections configured to calculate first and second beam diameters of the first light and second light from the images captured by the first and second cameras, and a lens adjustment section configured to move one of the lenses of the beam adjustment unit in a direction parallel to the optical path of the laser beam so that the first and second beam diameters match each other.

Description

technical field [0001] The invention relates to a laser beam adjustment mechanism and a laser processing device. Background technique [0002] In a laser processing apparatus that processes a workpiece by irradiating a laser beam, there is a mechanical error in which the beam diameter of the laser beam emitted from the laser oscillator differs for each laser oscillator. Therefore, a beam expander is used to adjust the beam diameter of the laser beam to a predetermined diameter and to adjust the laser beam to parallel light. [0003] The beam expander adjusts the laser beam to parallel light, and adjusts the beam diameter of the beam to a prescribed size. By using the beam expander, the beam diameter of the laser beam emitted from the laser oscillator can be made substantially uniform among devices. Therefore, mechanical errors of each laser processing device can be reduced. [0004] In the beam expander, as disclosed in Patent Document 1, a first concave lens, a convex le...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/064B23K26/073B23K26/03
CPCB23K26/064B23K26/073B23K26/032B23K26/0643B23K26/0648B23K26/705B23K26/0853B23K26/0821B23K26/082B23K26/0665
Inventor 小幡翼
Owner DISCO CORP
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