A cooling device for a system integrated circuit board
A technology for integrated circuit boards and heat dissipation devices, which is applied in the direction of circuits, electrical components, and electric solid devices, and can solve problems such as inability to clean circuit board dust, poor heat dissipation of circuit boards, etc., and achieve the effect of uniform heat dissipation
Active Publication Date: 2021-02-05
江西威尔高电子股份有限公司
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- Application Information
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Problems solved by technology
[0004] The technical problem to be solved by the present invention is to provide a heat dissipation device for a system integrated circuit board to solve the technical problem that the dust on the circuit board cannot be cleaned in the prior art, and the accumulation of dust leads to poor heat dissipation of the circuit board.
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[0028] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.
[0029] In describing the present invention, it should be understood that the terms "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", "vertical", The orientations or positional relationships indicated by "horizontal", "top", "bottom", "inner", "outer", etc. are based on the orientations or positional relationships shown in the drawings, and are only for the convenience of describing the present invention, rather than indicating or It should not be construed as limiting the invention by implying that a referenced device or element must have a particular orientation, be...
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The invention discloses a heat dissipation device for a system integrated circuit board, which belongs to the technical field of integrated circuits and includes a mounting box, a box cover, a rotating component, a dust removal component and a heat dissipation component. The box cover is arranged on the mounting box, and the mounting box There is a mounting plate inside, which divides the installation box into a first accommodation cavity and a second accommodation cavity. The rotating assembly is arranged on the box cover, the dust removal assembly is arranged on the installation box, and the heat dissipation assembly includes A heat dissipation member and a heat dissipation member, the heat dissipation member is arranged in the second accommodation cavity. In the present invention, two rotating motors work to drive two rotating screw rods to rotate, thereby driving the moving plate to move in the moving groove. The movement of the moving plate drives a number of dust removal rods to move, the movement of a number of dust removal rods drives a number of dust removal stickers to move, and the movement of a number of dust removal stickers affects the circuit. After the dust is removed, the heat dissipation effect of the circuit board will not be poor due to accumulation of dust, which will affect the normal operation of the circuit board.
Description
technical field [0001] The invention relates to the technical field of integrated circuits, in particular to a heat dissipation device for a system integrated circuit board. Background technique [0002] The system integrated circuit board is a kind of miniature electronic device or component. It adopts a certain process to interconnect the transistors, resistors, capacitors, inductors and other components and wiring required in a circuit, and make them in one or several small semiconductors. Chip or dielectric substrate, and then encapsulated in a package to become a microstructure with the required circuit functions; all the components have been structurally integrated, making electronic components towards miniaturization, low power consumption, intelligence and A big step forward in high reliability. [0003] For example, the patent with the publication number CN108922874A relates to a heat dissipation device for a system integrated circuit board, including a circuit boa...
Claims
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IPC IPC(8): H01L23/367H01L23/467H01L23/473B08B1/00B08B5/04
CPCH01L23/467H01L23/473H01L23/367B08B5/04B08B1/30
Inventor 唐伟
Owner 江西威尔高电子股份有限公司