Vacuum thermal insulation device with free gas absorbing part
A technology of vacuum insulation and free gas, which is applied in the direction of packaging objects under special gas conditions, packaging under vacuum/special atmosphere, internal accessories, etc. Thermal insulation performance, high availability, simple operation effect
Active Publication Date: 2019-11-26
重庆市大足区创新创业服务中心
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Problems solved by technology
[0003] Nowadays, in the actual processing of materials, it is often necessary to perform high-temperature vacuum treatment on materials, and this operation step requires high heat insulation performance of the device, but after high-temperature vacuum treatment through the devices purchased on the market today , some researchers have found that dew condensation easily occurs on the surface of the device in a high-temperature and high-humidity environment. down and inconvenience us
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[0039] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0040] Such as Figure 1-Figure 9 As shown, a vacuum heat insulation device with free gas adsorption components, the vacuum heat insulation device includes a first shell 1, and the first shell 1 includes an upper top plate 11, a lower bottom plate 12, a left side plate 13 and The right side plate 14, the two ends of the left side plate 13 and the right side plate 14 are connected with the upper top plate 11 and the lower bottom plate 12 respectively; The spac...
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The invention discloses a vacuum thermal insulation device with a free gas absorbing part. The vacuum thermal insulation device comprises a first shell, the first shell comprises an upper top plate, alower bottom plate, a left side plate and a right side plate, the two ends of the left side plate and the right side plate are connected with the upper top plate and the lower bottom plate correspondingly, a partition plate is horizontally arranged in the first shell, the partition plate divides the space in the first shell into an upper cavity and a lower cavity from top to bottom, the vacuum thermal insulation device further comprises a first gas absorbing device and a second gas absorbing device, the first gas absorbing device is located in the upper cavity, the second gas absorbing deviceis located in the lower cavity, and the partition plate is evenly provided with multiple through holes. The vacuum thermal insulation device is reasonable in structural design and easy to operate, material work in the high-temperature vacuum environment can be achieved effectively, meanwhile, through the first gas absorbing device and the second gas absorbing device, gas absorbing can be achieved, and the thermal insulation property of the whole device is ensured.
Description
technical field [0001] The invention relates to the technical field of vacuum heat insulation, in particular to a vacuum heat insulation device with free gas adsorption components. Background technique [0002] The vacuum heat insulator works by, for example, covering a core material having a fine and connected space inside glass wool or silica powder with an outer envelope having gas barrier properties and by depressurizing and sealing the inside of the outer envelope to manufacture. [0003] Nowadays, in the actual processing of materials, it is often necessary to perform high-temperature vacuum treatment on the materials, and this operation step requires high heat insulation performance of the device, but after high-temperature vacuum treatment through the devices purchased on the market today , some researchers have found that dew condensation easily occurs on the surface of the device in a high-temperature and high-humidity environment. Down and inconvenience us. [...
Claims
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Patent Timeline
Login to View More IPC IPC(8): B65D25/04B65D81/18B65D81/38B65D81/26B65D81/20
CPCB65D25/04B65D81/18B65D81/2038B65D81/266B65D81/3823
Inventor 匡宇翔
Owner 重庆市大足区创新创业服务中心