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Immersed cooling device

A cooling device, immersion technology, applied in cooling/ventilation/heating renovation, instruments, electrical digital data processing, etc., can solve problems such as difficulty in meeting heat dissipation requirements

Pending Publication Date: 2019-12-03
北京玖琳创新科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The traditional cooling method is air cooling, using fans for forced air convection, supplemented by a structural design with extremely high thermal conductivity, and the combination of the two achieves heat dissipation, but this traditional cooling method has been difficult to meet the cooling needs of today's computer and other fields

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Embodiment Construction

[0028] In order to enable those skilled in the art to better understand the technical solutions of the present invention, the present invention will be further described in detail below in conjunction with the accompanying drawings.

[0029] Such as Figure 1-6 As shown, an immersion cooling device provided by an embodiment of the present invention includes a holding tank 2, a condenser 3, and a water pump 4 that are sequentially connected through a pipeline 1 to form a circulation. Between 30-70 degrees; the electronic heating source 6 is fixed in the storage box 2, and a plurality of heat-conducting ribs 7 are arranged at intervals in the storage box 2. On the bottom plate 12 of the housing of the electronic heating source 6 A plurality of grooves 8 are provided, and each of the heat-conducting ribs 7 is snapped into each of the grooves 8 in a one-to-one correspondence; the housing bottom plate 12 and the heat-conducting ribs 7 are made of aluminum alloy.

[0030] Specifica...

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Abstract

The invention provides an immersed cooling device. The immersed cooling device comprises a containing box, a condenser and a water pump which are sequentially connected through a pipeline to form circulation, the temperature for converting liquid of a circulating medium into gas ranges from 30 DEG C to 70 DEG C, and the temperature for converting solid of the circulating medium into liquid rangesfrom -110 DEG C to -70 DEG C; an electronic heating source is fixed in the accommodating box, semiconductor cooling fins are arranged at the top of the accommodating box, a plurality of heat conduction convex edges are arranged in the accommodating box at intervals, a plurality of grooves are formed in a bottom plate of a shell of the electronic heating source, and the heat conduction convex edgesare clamped in the grooves in a one-to-one correspondence manner; and the shell bottom plate and the heat conduction convex edges are made of aluminum alloy materials. According to the immersed cooling device provided by the invention, the electronic heating source is immersed in the liquid medium, and the phase change of the liquid medium is used for cooling, so that compared with air convectioncooling, the cooling efficiency is greatly improved, and the heating and cooling requirements required by the data explosion era are met.

Description

technical field [0001] The invention relates to cooling technology, in particular to an immersion cooling device. Background technique [0002] With the rapid development of information technology, the amount of data transmission and processing has increased geometrically. For example, 5G technology has improved the quality of data transmission compared with 4G technology. At the same time, electronic components are also highly integrated, which has led to computer , the Internet of Things, various smart terminals, and other electronic components have simultaneously experienced a geometric increase in the heat generation. [0003] The traditional cooling method is air cooling, using fans for forced air convection, supplemented by a structural design with high thermal conductivity. The combination of the two achieves heat dissipation, but this traditional cooling method has been difficult to meet the cooling needs of today's computer and other fields. Contents of the invent...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20G06F1/20
CPCH05K7/203H05K7/20318H05K7/20327G06F1/20
Inventor 张文宾刘一航
Owner 北京玖琳创新科技有限公司