Backlight module and display device

Abstract

The invention discloses a backlight module and a display device, comprising: a miniature light-emitting diode lamp board and a scattering sheet; a plurality of support columns are fixed on the side surface of the scattering sheet facing the miniature light-emitting diode lamp board. The ordinary diffuser is used with the support column of the conical table structure to keep a certain light mixing distance between the micro-LED lamp board and the diffuser, so that the same backlight can be realized without the high-cost high-fog diffuser Effect. Ordinary diffusers have high light transmittance, which can reduce the energy consumption of micro-LED lamp panels. The bottom surface of the support column with a larger area of ​​the tapered platform structure is fixed on the surface of the scattering sheet, and the top surface with a smaller area is in contact with the micro-LED lamp board, which can reduce the contact area between the support column and the micro-LED lamp board, The probability that the support column is installed directly above the micro light emitting diode chip can be reduced, and the influence of the support column on the light emission of the micro light emitting diode chip can also be reduced.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a backlight module and a display device. Background technique [0002] The size of Mini Light Emitting Diode (Mini LED for short) is 100-300 μm, which is much smaller than that of traditional light emitting diodes. Using Mini LED as a backlight can increase the number of light sources, thus dimming The number of partitions has been made more detailed to achieve high dynamic range and high contrast effect, which stands out in the recent display field. [0003] At present, micro light-emitting diodes usually adopt the packaging technology (Chip On Board, referred to as COB) technology of directly bonding the chip on the substrate, which can achieve mass production output, small display pitch, good luminescence, and good impact resistance. Waterproof properties. The COB-Mini LED adopts the whole-layer coating packaging method, which has high packaging efficiency, but it cannot be...

AI Technical Summary

Problems solved by technology

The COB-Mini LED adopts the whole-layer coating packaging method, which has high packaging efficiency, but it cannot be mounted on the support column according to the original processing technology. High, large thickness, high haze, increased production costs

And when the high-haze diffuser is used, the transmittance loss is relatively large, resulting in increased energy consumption of the backlight

Images