A kind of thermoelectric cooling sheet based on 3D printing and its manufacturing method
A thermoelectric refrigerating sheet and a manufacturing method technology, which are applied in the directions of refrigerators, refrigeration and liquefaction, and machine operation modes, etc., can solve the problems affecting the processing stability and reliability of Bi2Te3-based thermoelectric devices, difficult to process alloys, poor mechanical properties, etc. problem, to achieve the effect of improving refrigeration effect, improving performance and low cost
Active Publication Date: 2022-01-04
WUHAN UNIV OF TECH
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[0003] The current commercial Bi2Te3-based alloys are mainly prepared by the zone melting method, but the anisotropic material obtained by the zone melting method has a large grain size and poor mechanical properties, which affects the processing stability and performance of Bi2Te3-based thermoelectric devices. Use reliability, it is difficult to process alloys with complex geometric features
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[0037] The present invention will be described in detail below in conjunction with the accompanying drawings and embodiments.
[0038] refer to Figure 1 to Figure 5 As shown, the 3D printing-based thermoelectric refrigeration chip in an embodiment provided by the present invention includes at least one pair of thermocouples connected by conductive materials and the substrate 3, and the thermocouples are distributed on the substrate 3. The thermocouples formed The pair includes two thermoelectric arms, the first conductive film 4 is connected between the two thermoelectric arms in the same thermocouple pair, the first conductive film 4 is attached to the cold end 6 of the thermoelectric arm, and the cold end 6 of the thermoelectric arm passes through the first The conductive film 4 is closely attached to the required cooling object 9, and the hot end 5 of the thermoelectric arm is connected to the substrate 3;
[0039] One thermoelectric arm in the same thermocouple pair is N...
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The invention discloses a thermoelectric cooling sheet based on 3D printing and a manufacturing method thereof, comprising at least one pair of thermocouples and a substrate connected by conductive materials, the thermocouples are distributed on the substrate, and the formed thermocouples include two Thermoelectric arm, the first conductive film is connected between the two thermoelectric arms in the same thermocouple pair, the first conductive film is attached to the cold end of the thermoelectric arm, and the hot end of the thermoelectric arm is connected to the substrate; one of the same thermocouple pair The thermoelectric arm is an N-type thermoelectric arm, and the other thermoelectric arm is a P-type thermoelectric arm; the area of the cold end of the thermoelectric arm is smaller than the area of the hot end of the thermoelectric arm. The refrigeration effect of the refrigeration sheet is improved, which is beneficial to the application of the semiconductor refrigeration sheet, improves the performance of the refrigeration sheet, and can be attached to any regular shape. Compared with the existing semiconductor refrigeration sheet, it has good refrigeration efficiency, high temperature control accuracy, It has the advantages of low cost, high material utilization rate and wide applicability.
Description
technical field [0001] The invention relates to the technical field of semiconductor devices, in particular to a thermoelectric cooling sheet based on 3D printing and a manufacturing method thereof. Background technique [0002] Semiconductor refrigeration, also known as thermoelectric refrigeration, is mainly the application of the Peltier effect, the inverse effect of the Seebeck effect, in refrigeration technology. It has the advantages of small size, low noise, no moving parts, and convenient adjustment and control. It is a new type of refrigeration. Way. [0003] The current commercial Bi2Te3-based alloys are mainly prepared by the zone melting method, but the anisotropic material obtained by the zone melting method has a large grain size and poor mechanical properties, which affects the processing stability and performance of Bi2Te3-based thermoelectric devices. Using reliability, it is difficult to process alloys with complex geometric features. [0004] Since the 3...
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IPC IPC(8): H01L35/32H01L23/34F25B21/02
CPCH01L23/34F25B21/02F25B2321/02H10N10/17
Inventor 熊新红邓建恩水贾鑫曹立才宗子凯卢文良朱子翰
Owner WUHAN UNIV OF TECH