Pressure-sensitive adhesive attaching device and attaching method
A laminating device and pressure-sensitive adhesive technology, which is applied in the directions of transportation and packaging, sending objects, thin material processing, etc., can solve the problems of insufficient adhesion between the adhesive and the substrate, low production efficiency, complex equipment composition, etc., and achieve processing efficiency Low heating efficiency, high heating efficiency, and the effect of ensuring consistent and stable glue surface temperature
Active Publication Date: 2019-12-13
SUZHOU HI TECH ELECTRONICS CO LTD
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Problems solved by technology
[0005] More and more new materials are used in pressure-sensitive adhesives, such as PP, PU, PVC, PE foam and other products are launched / transferred to production, such as foam series, acrylic core foam tape, etc.; foam series in DuPont During the test, there were occasional anchoring failures, and ODM foam tapes had chaotic bonding during laminating production, resulting in low production efficiency, insufficient adhesion between the glue and the substrate, and degumming.
[0006] The research process of the prior art mainly includes factors such as lamination temperature, pressure, corona dose setting, etc. The results show that the lamination temperature has an important influence on the wetting performance, thus disclosing the technology of gluing under heating to improve the adhesion of substrates At present, heating methods for pressure-sensitive adhesives, such as installing electric heating or heat-conducting oil tube heating on the bonding roller, have the disadvantages of complex equipment composition and high operating costs. High-quality and cheap pressure-sensitive adhesive bonding process and device
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[0045] In order to make the above objectives, features and advantages of the present invention more obvious and understandable, the technical solutions in the embodiments of the present invention will be described clearly and completely in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work shall fall within the protection scope of the present invention.
[0046] The embodiment of the present invention provides a pressure-sensitive adhesive bonding device, such as figure 1 Shown, including:
[0047] Machine 1, supporting the first substrate to be laminated with pressure sensitive adhesive, and having a control unit on machine 1;
[0048] The infrared drying device 2 includes an i...
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The invention discloses a pressure-sensitive adhesive attaching device. The device comprises a machine table and an infrared drying device, wherein the machine table supports a first base material which is for a pressure-sensitive adhesive to be attached, and the machine table is provided with a control unit; the infrared drying device comprises an infrared heat source, wherein the infrared heat source is arranged at a preset height position of the surface of the pressure-sensitive adhesive, and the preset height is adjustable; and the control unit is used for controlling heating of the infrared drying device and relative movement with the machine table. The invention further discloses an attaching method of the pressure-sensitive adhesive attaching device. The pressure-sensitive adhesiveattaching device and the attaching method have the advantages that the temperature is precisely controlled, the use is convenient and rapid, and it is ensured that the temperature of the adhesive surface is consistent and stable.
Description
Technical field [0001] The invention relates to the technical field of industrial adhesive bonding technology, in particular to a pressure-sensitive adhesive bonding device and a bonding method. Background technique [0002] Pressure-sensitive adhesives are mainly acrylic and rubber solvent-based or latex-based adhesives; [0003] The composition of pressure-sensitive adhesive The adhesive tape is a special type of adhesive, that is, the glue is applied to the substrate and processed into a strip and made into a reel for supply. It includes solvent-activated adhesive tape, heating-type adhesive tape and pressure-sensitive adhesive tape. Adhesive tape. For example, adhesive plasters and electrical insulating adhesives used daily in medicine belong to pressure-sensitive adhesive tapes. The composition of pressure-sensitive tapes: ①pressure-sensitive adhesive ②substrate ③primary treatment agent ④back treatment agent ⑤release paper; the main pressure-sensitive adhesive The ingredient...
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IPC IPC(8): B65H37/04
CPCB65H37/04
Inventor 郭友成
Owner SUZHOU HI TECH ELECTRONICS CO LTD