Anti-interference and overload-resistant MEMS accelerometer

Abstract

The invention discloses an anti-interference and overload-resistant MEMS (Micro-Electro-Mechanical System) accelerometer. The accelerometer comprises a substrate layer, an induction electrode layer, amovable sensitive structure layer and a cap which are bonded in sequence. The induction electrode layer comprises an induction electrode center anchor point and induction electrodes on the two sides.The movable sensitive structure layer comprises a first movable sensitive structure center anchor point, a first solid movable sensitive structure and a first hollow movable sensitive structure. A silicon support column is arranged at the bottom of each induction electrode. The top end of each silicon support column is connected with the corresponding induction electrode, and the bottom end of each silicon support column is connected with the substrate layer. A second movable sensitive structure central anchor point, a second solid movable sensitive structure and a second hollow movable sensitive structure are respectively and symmetrically bonded above the first movable sensitive structure central anchor point, the first solid movable sensitive structure and the first hollow movable sensitive structure. A closed cavity is formed between the first hollow movable sensitive structure and the second hollow movable sensitive structure. The influence of the external environment on the performance of the device can be reduced, and the reliability of the device can be improved.

Description

technical field [0001] The invention relates to the technical field of micro-mechanical electronics, in particular to an anti-interference and overload-resistant MEMS accelerometer. Background technique [0002] MEMS (Micro-Electro-Mechanical Systems) is the abbreviation of Micro-Electro-Mechanical Systems. MEMS manufacturing technology uses micro-nano processing technology, especially the related technology of semiconductor wafer manufacturing, to manufacture various micro-nano mechanical structures, combined with dedicated control integration Circuits (ASIC), composed of intelligent micro-sensors, micro-actuators, micro-optical devices and other MEMS components. MEMS components have the advantages of small size, low cost, high reliability, low power consumption, high degree of intelligence, easy calibration, and easy integration, and are widely used in aerospace, medical, industrial production and various consumer products . [0003] At present, foreign high-performance ...

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Problems solved by technology

[0003] At present, foreign high-performance MEMS accelerometer products are relatively mature and have been widely used in many aspects. Domestic high-performance MEMS accelerometers have been deeply researched and developed, and some companies or laboratories have prepared high-precision single-axis accelerometers. Or multi-axis accelerometer products, but they are lacking in anti-interference and overload resistance, which limits their application in high-impact environments

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