Plasma equipment, semiconductor manufacturing method, and gas delivery source

Abstract

The present disclosure provides a plasma device, a semiconductor manufacturing method, and a gas delivery source. The plasma equipment includes a plurality of chamber walls, a chamber window, a plasma antenna, a substrate carrying platform, a gas delivery source and a fastening device. A plurality of chamber walls and a chamber window define an enclosed space. The chamber window is disposed between the plasma antenna and the substrate carrying platform. A gas delivery source is mechanically coupled to the chamber window. The gas delivery source includes a gas injector. The gas injector has a channel, a window at a first end of the channel, and a nozzle at a second end of the channel. The nozzle of the gas delivery source is arranged in the closed space. The fastening device is mechanically coupled to the gas delivery source. The fastening device is adjustable for adjusting a sealing force applied to the gas injector.

Description

technical field [0001] The present disclosure relates to a plasma device, a semiconductor manufacturing method, and a gas delivery source. Background technique [0002] In recent years, semiconductor integrated circuits have experienced exponential growth. Technological advances in integrated circuit materials and design have resulted in generations of integrated circuits, with each generation having smaller and more complex circuits than the previous generation. During the development of integrated circuits, when the geometric size (that is, the smallest element or line that can be produced in the manufacturing process) shrinks, the functional density (that is, the number of interconnect devices per chip area) Usually increases. Generally speaking, such size reduction manufacturing process can provide benefits of increasing production efficiency and reducing manufacturing cost. However, such size reduction manufacturing process will also increase the complexity of manufac...

AI Technical Summary

Problems solved by technology

Generally speaking, this kind of manufacturing process with reduced size can provide the benefits of increasing production efficiency and reducing manufacturing costs. However, this kind of manufacturing process with reduced size will also increase the complexity of manufacturing and producing integrated circuits.

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