Exhaust system for semiconductor heat treatment device, and semiconductor heat treatment device

Abstract

The invention provides an exhaust system for semiconductor heat treatment device. The exhaust system includes a transfer pipe, an exhaust box and an isolation valve. The transfer pipe has a first airinlet and a first air outlet. The air exhaust box has a second air inlet and a second air outlet. An auxiliary sealing plate is arranged between the first air outlet and the second air inlet. A firstopening is formed on the auxiliary sealing plate, and can communicate the second air inlet with the first air outlet. The valve plate of the isolation valve is disposed at the auxiliary sealing plate.The area of the first opening is less than the area of the valve plate, so that the valve plate can close the first opening when in a closed state. The invention also provides a semiconductor heat treatment device. The exhaust system can ensure that the isolation valve completely closes the exhaust outlet of the semiconductor heat treatment device.

Description

technical field [0001] The invention relates to the field of semiconductor equipment, in particular to an exhaust system for semiconductor heat treatment equipment and semiconductor heat treatment equipment. Background technique [0002] Semiconductor heat treatment equipment is an important process equipment for integrated circuit manufacturing. The semiconductor heat treatment equipment includes a rapid heating and cooling furnace body, which is suitable for various oxidation, annealing and film growth processes in the integrated circuit manufacturing process. In order to meet the process requirements and improve product productivity, it is necessary to heat up the semiconductor wafer to the process temperature as quickly as possible within the range that does not cause damage to the semiconductor wafer, or to cool the semiconductor wafer in a high temperature state as quickly as possible. circle, so it is necessary to rapidly raise and lower the temperature of the furnace...

AI Technical Summary

Problems solved by technology

[0004] (1) The front-end assembly 01 of the exhaust valve and the valve driving device 04 are complex in structure, occupy a large space, and have high cost;

[0005] (2) When the exhaust valve 02 is closed, the furnace mouth cannot be completely closed, causing heat loss and affecting the rapid heating rate of the furnace body;

[0006] (3) When the exhaust valve 02 is closed, that is, when the rapid heating and cooling furnace body heats up, the exhaust valve shaft 03 is exposed to a high-temperature environment, causing the exhaust valve shaft 03 to deform under the action of high temperature, which affects the exhaust valve 02. Normal opening and closing;

[0007] (4) Since the front-end assembly 01 of the exhaust valve and the insulation cover 07 outside the exhaust box 05 are not fixed, the heat will be dissipated from the gap of the insulation cover 07 into the surrounding environment of the exhaust system, resulting in high ambient temperature, and the exhaust valve is driven Parts such as the cylinder bracket in device 04 are deformed, affecting normal use;

[0008] (5) The cylinder driving impact force in the exhaust valve drive device 04 is large, which affects the stability of the entire exhaust mechanism

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