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A preparation device for integrated packaging adhesive film photovoltaic glass

A technology of encapsulating adhesive film and photovoltaic glass, which is applied in photovoltaic power generation, semiconductor devices, electrical components, etc., can solve the long-term or short-term reliability impact of components, increase the production cycle of crystalline silicon solar cell components, increase the repetitive operation of employees, etc.

Active Publication Date: 2021-09-14
晶澳(扬州)新能源有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

During the whole process, glass and encapsulation film need to be placed or removed in layers many times, which increases the repetitive operations of employees, increases the production cycle of crystalline silicon solar cell modules, and reduces production efficiency.
[0003] At the same time, the storage conditions and time of the packaging film have a great impact on the performance of the film. If it is not stored properly, the additives in the packaging material will fail; when it is applied in the production line, the peeling force between the film and the glass will become worse. Detrimental impact on component long-term or short-term reliability
[0004] In addition, for special component structures, sometimes it is necessary to use multi-layer packaging materials. In order to meet the requirements, the production cycle and layout of the production line will need to undergo great changes, resulting in poor compatibility.

Method used

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  • A preparation device for integrated packaging adhesive film photovoltaic glass

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0044] The preparation method of the integrated encapsulation adhesive film photovoltaic glass provided in this embodiment includes the following steps: selecting photovoltaic glass, laying an encapsulation adhesive film raw material on the photovoltaic glass, setting an anti-adhesive layer on the encapsulation adhesive film raw material, and then Using a flat vulcanizer, press at a preset temperature and pressure for a preset time and then remove the anti-adhesive layer to obtain an integrated packaged thin-film photovoltaic glass.

[0045] The packaging film raw material is the resin particles and additives disclosed in the patent CN 102115642 A, specifically the EVA packaging film raw material.

[0046] The preset temperature is 105° C., the preset pressure is 300 mbar, and the preset time is 3 minutes.

[0047] The laying amount of packaging film raw material is 420g / m 2 .

[0048] The anti-sticking cloth is Teflon high-temperature anti-sticking cloth.

Embodiment 2

[0050] The preparation method of the integrated encapsulation adhesive film photovoltaic glass provided in this embodiment includes the following steps: selecting photovoltaic glass, laying an encapsulation adhesive film raw material on the photovoltaic glass, setting an anti-adhesive layer on the encapsulation adhesive film raw material, and then Using a flat vulcanizer, press at a preset temperature and pressure for a preset time and then remove the anti-adhesive layer to obtain an integrated packaged thin-film photovoltaic glass.

[0051] The encapsulating film raw material can refer to the raw materials disclosed in CN 109705773 A and CN_108795124_A patents, specifically polyolefin POE.

[0052] The preset temperature is 120° C., the preset pressure is 400 mbar, and the preset time is 4 minutes.

[0053] The laying amount of encapsulation film raw material is 500g / m 2 .

[0054] The anti-sticking cloth is a special high-temperature anti-sticking cloth for commercially avai...

Embodiment 3

[0056] The preparation method of the integrated encapsulation adhesive film photovoltaic glass provided in this embodiment includes the following steps: selecting photovoltaic glass, laying an encapsulation adhesive film raw material on the photovoltaic glass, setting an anti-adhesive layer on the encapsulation adhesive film raw material, and then Using a flat vulcanizer, press at a preset temperature and pressure for a preset time and then remove the anti-adhesive layer to obtain an integrated packaged thin-film photovoltaic glass.

[0057] For Borealis Quentys polyolefin encapsulation film BPO8828F, the preset temperature is 145°C, the preset pressure is 700mbar, and the preset time is 3min.

[0058] The laying amount of encapsulation film raw material is 460g / m 2 .

[0059] The anti-adhesive layer is not bonded to the packaging film raw material, and the anti-adhesive layer is an anti-adhesive film.

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Abstract

The invention discloses a method for preparing photovoltaic glass with an integrated encapsulation adhesive film, comprising the following steps: selecting photovoltaic glass, laying an encapsulation adhesive film raw material on the photovoltaic glass, setting an anti-adhesive layer on the encapsulation adhesive film raw material, Then use a flat vulcanizer to press at a preset temperature and pressure for a preset time and then remove the anti-adhesive layer to obtain an integrated packaged thin-film photovoltaic glass. The method combines the photovoltaic glass and the encapsulation film, simplifies the material preparation and lamination process, reduces the production cycle of the crystalline silicon solar cell module, especially the production of the double glass module, and improves the production efficiency. The invention also discloses a preparation device for the integrated encapsulation adhesive film photovoltaic glass.

Description

technical field [0001] The invention belongs to the technical field of photovoltaic modules, and in particular relates to a method and device for preparing photovoltaic glass with an integrated packaging adhesive film. Background technique [0002] At present, the preparation process of crystalline silicon solar cell modules is basically divided into cell string welding, BOM (bill of materials, bill of materials) material preparation, lamination, EL (electro luminescence, electroluminescence) inspection, lamination, framing and test packaging ;In the process of BOM preparation and lamination, since the current encapsulation film is basically coil packaging, it is necessary to cut the encapsulation film into sheets according to the size of the component using a cutting device for the subsequent lamination process. The layering process needs to place the glass on the bottom layer first, and spread the encapsulation film on the glass according to the specifications before perfo...

Claims

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Application Information

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IPC IPC(8): H01L31/048
CPCH01L31/0481Y02E10/50
Inventor 薛文娟周艳方
Owner 晶澳(扬州)新能源有限公司
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