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Semiconductor structure and manufacturing method thereof

A manufacturing method, semiconductor technology, applied in the direction of semiconductor/solid-state device manufacturing, semiconductor devices, electrical components, etc.

Active Publication Date: 2020-01-03
TAIWAN SEMICON MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, as the size shrinks, new challenges arise

Method used

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  • Semiconductor structure and manufacturing method thereof
  • Semiconductor structure and manufacturing method thereof
  • Semiconductor structure and manufacturing method thereof

Examples

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Embodiment Construction

[0058] The following presents a number of different embodiments, or examples, for implementing different components of the presented subject matter. Specific examples of components and configurations are described below to simplify embodiments of the present disclosure. Of course, these are just examples, not intended to limit the embodiments of the present disclosure. For example, if the description mentions that a first part is formed above a second part, it may include an embodiment where the first and second parts are in direct contact, and may also include an additional part formed between the first and second parts , such that the first and second components are not in direct contact. In addition, the embodiments of the present disclosure may repeat reference numerals and / or letters in different examples. This repetition is for the purpose of simplification and clarity, and does not mean that there is a specific relationship between the different embodiments and / or conf...

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Abstract

The present invention provides a manufacturing method of a semiconductor structure and a semiconductor structure. Embodiments disclosed herein relate to using an implantation process and a melting anneal process performed on a nanosecond scale to achieve a high surface concentration (surface pile up) dopant profile and a retrograde dopant profile simultaneously. In an embodiment, a method includesforming a source / drain structure in an active area on a substrate, the source / drain structure including a first region comprising germanium, implanting a first dopant into the first region of the source / drain structure to form an amorphous region in at least the first region of the source / drain structure, implanting a second dopant into the amorphous region containing the first dopant, and heating the source / drain structure to liquidize and convert at least the amorphous region into a crystalline region, the crystalline region containing the first dopant and the second dopant.

Description

technical field [0001] The present disclosure relates to semiconductor fabrication technology, and in particular, to source / drain structures and fabrication methods thereof. Background technique [0002] As the semiconductor industry has progressed to the nanotechnology process node (node) in pursuit of higher device density, higher efficiency and lower cost, challenges from both manufacturing and design have led to the development of three-dimensional designs, such as fin Field Effect Transistors (Fin Field Effect Transistors, FinFETs). FinFET devices generally include semiconductor fins with high aspect ratios, and channels and source / drain regions are formed in these semiconductor fins. Gates are formed above and along the sides of the fin structures (eg, wrapping), which takes advantage of increased channel surface area to produce faster, more reliable, and better-controlled semiconductor transistor devices. [0003] FinFET devices typically include semiconductor regio...

Claims

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Application Information

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IPC IPC(8): H01L21/336H01L29/78H01L29/08H01L21/324
CPCH01L29/785H01L29/66795H01L29/0847H01L21/324H01L29/66545H01L21/823431H01L21/823418H01L21/02532H01L21/02675H01L29/7848H01L29/165H01L29/267H01L29/161H01L21/26506H01L29/167H01L29/665H01L29/66636H01L21/76855H01L21/28518H01L21/76843H01L29/6681H01L21/02694H01L21/76829H01L21/823814H01L21/823864
Inventor 刘书豪陈文彦陈国儒王立廷陈亮吟张惠政王英郎
Owner TAIWAN SEMICON MFG CO LTD