Semiconductor structure and manufacturing method thereof
A manufacturing method, semiconductor technology, applied in the direction of semiconductor/solid-state device manufacturing, semiconductor devices, electrical components, etc.
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[0058] The following presents a number of different embodiments, or examples, for implementing different components of the presented subject matter. Specific examples of components and configurations are described below to simplify embodiments of the present disclosure. Of course, these are just examples, not intended to limit the embodiments of the present disclosure. For example, if the description mentions that a first part is formed above a second part, it may include an embodiment where the first and second parts are in direct contact, and may also include an additional part formed between the first and second parts , such that the first and second components are not in direct contact. In addition, the embodiments of the present disclosure may repeat reference numerals and / or letters in different examples. This repetition is for the purpose of simplification and clarity, and does not mean that there is a specific relationship between the different embodiments and / or conf...
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