A mes system-based LED wafer test disassembly machine splitting and collecting method
A wafer testing and wafer technology, applied in the field of LED chip testing and production, can solve the problems of heavy manual report tracking workload, affecting product production cycle, poor timeliness, etc., to reduce production error rates and reduce split batches. time, the effect of reducing workload
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[0021] The technical solutions of the present invention will be clearly and completely described below. Obviously, the described embodiments are part of the embodiments of the present invention, but not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.
[0022] like figure 1 As shown in the figure, when a mother batch of LED wafers needs to be inspected, in order to speed up the inspection efficiency, the batch of LED wafers is divided into 4 sub-batches, and each sub-batch contains 3 wafers. The LED wafer test batch split and merge management system of the MES system provided by the invention performs batch split production processing, such as image 3 shown, including the following steps:
[0023] 1) The mother batch of LED wafers in the state to be tested after production is uniformly packed...
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