Thin plate-type heat pipe using pipe body and method for manufacturing same

A manufacturing method and thin-plate technology, applied in the direction of cooling/ventilation/heating transformation, electric solid-state devices, semiconductor devices, etc., to achieve the effect of accelerating thinning, increasing length and width
CN110679208AActive Publication Date: 2020-01-10CGI SRL
7 Cites 0 Cited by

Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
CGI SRL
Publication Date
2020-01-10

Smart Images

  • Figure 1
    Figure 1
  • Figure 2
    Figure 2
  • Figure 3
    Figure 3
Patent Text Reader

Abstract

Provided in the present invention are a thin plate-type heat pipe using a pipe body and a method for manufacturing same, comprising the steps of: manufacturing a circular pipe by cutting a metal pipematerial; press-processing the circular pipe while a moving frame is inserted into the circular pipe to form a plurality of protrusions on the inner surface of the circular pipe, so as to form a throttle way between the plurality of protrusions; forming a wick space by press-processing the circular pipe while the moving frame is inserted into the circular pipe; arranging, in the wick space, a fiber wick comprising aramid fiber which has been reformed to be hydrophilic; forming a housing by closing the two ends of the circular pipe while the fiber wick is arranged; and injecting, into the housing, a working fluid flowing through the throttle way through an injection port, rendering the inside of the housing into a vacuum state through the injection port, and then sealing the injection port.
Need to check novelty before this filing date? Find Prior Art

Description

technical field

[0001] The present invention relates to a thin-plate type heat pipe using a pipe body and a manufacturing method thereof. Background technique

[0002] Generally, a heat pipe is a heat transfer mechanism having a thermal conductivity several tens of times higher than that of a thermally conductive metal. Recently, it is being developed into a thin plate shape to cool the heat sink with a large area, such as the CPU of a computer. The thin plate heat pipe is usually made into figure 1 Shape shown (Granted Patent No. 10-0698462).

[0003] Such as figure 1 As shown, the thin-plate heat pipe 101 is composed of an outer shell 103 and a core structure 105. The outer shell 103 is formed by laminating an upper plate 131 and a lower plate 132. The core structure 105 passes through the working fluid contained in the shell 103. A supporting structure 107 such as a mesh and a screen is formed in the housing 103 .

[0004] Since the heat pipe 101 utilizes a fiber aggr...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More