A measurement method and device for rotation compensation of a two-dimensional coordinate system

Abstract

The present invention relates to the technical field of transistor packaging, in particular to a measurement method for rotation compensation of a two-dimensional coordinate system; comprising: establishing a basic coordinate system of a tube seat; The focus of the Y-axis sideline is the origin; draw the outer circle of the tube base and the two insulator circles of the tube base; connect the centers of the two insulators to construct a fitting line; translate the center of the base coordinate system of the tube base to the Describe the center of the tube base, rotate the basic coordinate system of the tube base according to the angle of the fitting line and save the coordinate system after rotation compensation; draw the photosensitive area of ​​the tube base chip, and obtain the coordinates of the photosensitive area relative to the rotation compensation according to the coordinate algorithm System coordinate position. The crystal bonding position of the tube base is adjusted according to the coordinate position of the photosensitive area relative to the coordinate system after the rotation compensation. The embodiment of the present invention uses coordinate system rotation compensation to ensure the accuracy of chip bonding of TO products to the greatest extent.

Description

technical field [0001] The invention relates to the technical field of TO packaging of semiconductor lasers, in particular to a method and device for measuring rotation compensation of a two-dimensional coordinate system. Background technique [0002] Semiconductor laser TO has the advantages of small size, light weight, high efficiency, long life, easy modulation and low price, and has been widely used in industrial, medical and military fields, such as material processing, optical fiber communication, laser ranging, target indication , laser guidance, laser radar, space optical communication, etc. With the continuous development of semiconductor laser TO in various application fields, the requirements for the placement accuracy of semiconductor laser TO products are getting higher and higher. [0003] At present, the measurement of TO package die-bonding placement has always been measured with the mechanical coordinate system of the measuring equipment as the reference co...

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Problems solved by technology

[0003] At present, the measurement of TO package die-bonding placement has always been measured with the mechanical coordinate system of the measuring equipment as the reference coordinate system; for example, in the TO-CAN 46 product packaging process, there are 2PIN, 3PIN, 4PIN...7PIN, For tube sockets with various pin positions such as 8PIN, due to the mismatch of the measurement fixture and the rotation of the tube socket during the packaging process, the accuracy of normal measurement is inaccurate, especially in high-speed products (Note: high-speed products have a negative impact on the photosensitive surface of the chip. Eccentric mounting is required to meet the requirements of the return loss of the product during use and to ensure normal signal transmission)

[0004] The mechanical coordinate system of the product cannot be measured accurately due to the slight rotation of the TO tube holder, which will seriously affect the chip placement accuracy of the product, and eventually cause the product performance to fail to meet the requirements

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