A kind of electronic skin with hierarchical pressure peak structure and preparation method thereof
An electronic skin and conductivity technology, applied in the field of sensors, can solve the problems of limited application prospects and low sensitivity, and achieve the effects of good repeatability, high sensitivity, and rapid response and recovery ability.
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
preparation example Construction
[0054] The present invention also provides a method for preparing an electronic skin with a hierarchical pressure peak structure, which includes the following steps:
[0055] S1 prepares a flexible substrate with a pressure-sensitive layer sputtered on the surface:
[0056] First prepare a master template with a raised structure on the surface, wash and dry it, then use the master template to prepare an inversion mold and prepare an isolation layer on the surface of the inversion mold, then use the inverse mold with an isolation layer on the surface to prepare a flexible substrate, and finally in the flexible substrate. A pressure-sensitive layer is sputtered on the surface of the substrate to obtain a flexible substrate with a pressure-sensitive layer sputtered on the surface, specifically:
[0057] S11 master template production: the metal block is made into a master template with a raised structure array on the surface through a CNC grinding machine;
[0058] S12 Pretreatm...
Embodiment 1
[0081] This example is the preparation of electronic skin with hierarchical pressure peak structure based on magnetron sputtering gold, PVP nanowire network and micro-pyramid array. The following steps are specifically used for preparation:
[0082] 1) The metal block is made into a master template with a pyramid array on the surface by a CNC grinding machine;
[0083] 2) Sonicate the completed master template with ethanol for 10 minutes, then sonicate with deionized water for 10 minutes, then sonicate with ethanol for 10 minutes, and dry at 50°C;
[0084] 3) Pour the pre-mixed polydimethylsiloxane (PDMS) on the surface of the master template, and after drying, peel off to obtain the first mold;
[0085] 4) sputtering a gold layer on the surface of the first inverted mold;
[0086]5) Pour the pre-mixed polydimethylsiloxane (PDMS) on the surface of the first mold, after drying, peel off to obtain a flexible substrate with a micro-pyramid array, and the height of the micro-pyra...
Embodiment 2
[0094] This implementation is the preparation of electronic skin with hierarchical pressure peak structure based on graphene, PVP nanowire network and micro-hemispheric array. The following steps are specifically used for preparation:
[0095] 1) Prepare a master template with micro-hemispherical pits on a silicon wafer by photolithography;
[0096] 2) After the finished master template is sonicated with ethanol for 30 minutes, sonicated with deionized water for 15 minutes, then sonicated with ethanol for 20 minutes, and dried at 40°C;
[0097] 3) Pour the pre-mixed polydimethylsiloxane (PDMS) on the surface of the master template, and after drying, peel off to obtain the first mold;
[0098] 4) layered self-assembled graphene on the surface of the first inverted mold to form an isolation layer;
[0099] 5) Pour the pre-mixed polydimethylsiloxane (PDMS) on the surface of the first mold, and after drying, peel it off to obtain a flexible substrate with a micro-hemisphere array...
PUM
Property | Measurement | Unit |
---|---|---|
electrical conductivity | aaaaa | aaaaa |
thickness | aaaaa | aaaaa |
diameter | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com