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LED lamp

A technology of LED lamps and LED filaments, applied in lighting devices, cooling/heating devices of lighting devices, light sources, etc., can solve the problems of poor heat dissipation and waterproof effect, difficult to disassemble and replace LED filaments, and achieve convenient heat dissipation and disassembly Easy to assemble and disassemble

Inactive Publication Date: 2020-01-17
福建明旺能源科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Nowadays, LED lights are widely used, and the LED filament is difficult to disassemble and replace. When one LED filament is damaged, the other LED filaments cannot be used, and the heat dissipation and waterproof effect is poor.

Method used

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Experimental program
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Effect test

Embodiment 1

[0028] The present invention provides Figure 1-3 An LED lamp comprising a first annular plate 1 and a circular tube 3, a first metal circular ring 2 is pasted on the bottom of the first circular plate 1, and the top of the circular tube 3 is pasted inside the inner ring of the first circular plate 1, The bottom of the round tube 3 is pasted with a second metal ring 4, a detachable LED filament 5 is installed between the first metal ring 2 and the second metal ring 4, and the negative and positive connectors of the LED filament 5 are connected to the first A metal ring 2 and a second metal ring 4 are electrically connected; both the top of the second metal ring 4 and the bottom of the first metal ring 2 are provided with an insertion slot 15, the negative terminal and the positive terminal of the LED filament 5 They are plugged into the upper and lower plug slots 15 respectively. The middle part of the negative terminal and the positive terminal of the LED filament 5 is provide...

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PUM

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Abstract

The invention discloses an LED lamp. The LED lamp comprises a first annular plate and a circular tube, the top of the circular tube is pasted in the inner ring of the first annular plate, a second metal circular ring is pasted at the bottom of the circular tube, a detachable LED lamp filament is installed between a first metal circular ring and the second metal circular ring, and a negative electrode connector and a positive electrode connector of the LED lamp filament are electrically connected with the first metal circular ring and the second metal circular ring respectively; a second circular plate is integrally formed above the first annular plate through a circular rod, a metal threaded shell is arranged on the outer wall of the connector, a metal block is installed in the middle of the top of the connector, the first metal circular ring is electrically connected with the metal threaded shell through a wire, and the second metal circular ring is electrically connected with the metal block through a wire; heat dissipation holes are formed in the first annular plate, and a detachable transparent glass cover is installed at the bottom of the first annular plate. The transparent glass cover and the LED lamp filament are convenient to disassemble and assemble, the LED lamp filament is convenient to replace, and the heat dissipation and waterproof effects are good.

Description

Technical field [0001] The invention belongs to the technical field of LED lamps, and specifically relates to an LED lamp. Background technique [0002] Compared with the luminous effect of traditional light sources, LED light sources are low-voltage microelectronics products that successfully integrate computer technology, network communication technology, image processing technology, and embedded control technology. The chip size used in the traditional LED lamp is 0.25mmX0.25nm, and the size of the lighting LED is generally above 1.0mmX1.0mm. The working bench structure, inverted pyramid structure and flip chip design of LED die molding can improve its luminous efficiency, thereby emitting more light. Innovations in LED packaging design include high-conductivity metal block substrates, flip-chip designs, and bare-disk casting lead frames. These methods can be used to design high-power, low-thermal resistance devices, and these devices have better illuminance than traditional ...

Claims

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Application Information

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IPC IPC(8): F21K9/235F21K9/237F21K9/238F21V17/12F21V19/00F21V29/83F21V31/00F21Y115/10
CPCF21K9/235F21K9/237F21K9/238F21V17/12F21V19/001F21V29/83F21V31/00F21Y2115/10
Inventor 吴赵平
Owner 福建明旺能源科技有限公司