A printed circuit board containing heat dissipation medium and its preparation method

Abstract

The invention discloses a printed circuit board containing a heat dissipation medium and a preparation method thereof, wherein the printed circuit board includes a multi-layer core board, and a core board for bonding the core boards is arranged between two adjacent core boards Adhesive sheet, core board slots are provided on the core board where the heat dissipation medium needs to be embedded, and core board adhesive sheet slots are opened on the position where the heat dissipation medium needs to be embedded on the core board adhesive sheet; the core board groove and the core board adhesive sheet The grooves form a heat dissipation medium groove, and the heat dissipation medium is arranged in the heat dissipation medium groove; each core board includes a metal layer, and the multilayer metal layer includes at least one grounding part, and the grounding part is exposed on the side wall of the heat dissipation medium groove; on the surface of the heat dissipation medium groove The local area corresponding to the grounding part is provided with a conductive part, and the grounding part is in contact with the corresponding conductive part to form an electrical connection. The invention realizes the selective electrical connection between the metal layer and the heat dissipation medium by selectively arranging the conductive part, and is suitable for laying different network lines in the printed circuit board.

Description

technical field [0001] The invention relates to the field of printed circuit boards, in particular to a printed circuit board containing a heat dissipation medium and a preparation method thereof. Background technique [0002] In the design of printed circuit boards, in order to achieve interlayer interconnection, multilayer boards are usually pressed together, and then drilled and metallized. The following disadvantages: 1) Connecting through metallized holes can only achieve direct connection at the drilled hole position, and the transmission path away from the hole is far away. When high-frequency or high-speed signal transmission, the stratum shielding effect is poor; 2) Manufacturing process The process is complicated, and it is realized by chemical potion, which is harmful to the environment, and the metallized holes need to be realized by electroplating, which consumes energy. [0003] Patent CN107734837A discloses a rapid heat dissipation PCB, which specifically inc...

AI Technical Summary

Problems solved by technology

[0002] In the design of printed circuit boards, in order to achieve interlayer interconnection, multilayer boards are usually pressed together, and then drilled and metallized. The following disadvantages: 1) Connecting through metallized holes can only achieve direct connection at the drilled hole position, and the transmission path away from the hole is far away. When high-frequency or high-speed signal transmission, the stratum shielding effect is poor; 2) Manufacturing process The process is complicated, and it is realized by chemical potion, which is harmful to the environment, and the metallized holes need electroplating to realize, which consumes energy

However, this patent is only applicable to the case where the corresponding metal layers above the conductive and heat-conducting adhesive sheet belong to the same network that needs to be connected to the metal block. It is not applicable when some of the corresponding metal layers above the electrically-conductive and heat-conducting adhesive sheet do not need to be connected to the metal block. Selectivity, which is not conducive to laying lines of different networks in the inner layer

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