Multi-stage resin surface etching method, and plating method on resin using same

Abstract

The present invention provides a resin surface etching method characterized in that, in etching a resin surface, one set of steps (a) and (b), is performed two or more times without performing a resinswelling step, wherein step (a) is a step for treating the resin surface with a solution containing an oxidizing agent and adsorbing the oxidizing agent on the resin surface, and step (b) is a step for activating the oxidizing agent adsorbed on the resin surface in step (a). This rein surface etching method provides a novel technique operable at an industrial level, as a resin etching technique that does not use a chromic acid.

Description

technical field [0001] The present invention relates to a multi-stage etching method for resin surfaces and a method for plating resins using the same. Background technique [0002] Conventionally, it is known that, in order to improve the adhesion between the plastic surface and the plating film, the plastic surface is treated with a mixed solution of chromic acid and sulfuric acid before the plating treatment in the case of metallizing the plastic surface by plating. Rough etching is performed. [0003] However, since the above-mentioned etching process uses harmful hexavalent chromium and operates at a high temperature of 60° C. or higher, there are problems in that the working environment is deteriorated, and the waste water treatment requires attention. [0004] In addition, in recent years, a technique of etching the surface of plastics using permanganic acid has also been reported (Patent Document 1), but permanganic acid may decompose rapidly depending on the condit...

AI Technical Summary

Problems solved by technology

[0003] However, in the above-mentioned etching treatment, since harmful hexavalent chromium is used to work at a high temperature of 60°C or higher, there are problems in that the working environment is deteriorated, and the waste water treatment also requires attention.

[0004] In addition, in recent years, a technique of etching the surface of plastics using permanganic acid has also been reported (Patent Document 1), but permanganic acid may decompose rapidly depending on the conditions of use, and there may be problems in industrial use.

[0005] Thereafter, in order to suppress the decomposition of the etching solution using the above-mentioned permanganic acid, it has also been reported to contain permanganic acid, a specific inorganic acid, and a The composition for etching treatment (Patent Document 2) containing one component of salt is expensive due to the use of the above components in a large amount, which still has problems in industrial use

[0006] In addition, in order to suppress the decomposition of the etching solution containing the above-mentioned permanganic acid, it has also been reported that after the resin is swelled with an aqueous dispersion or aqueous solution containing a specific organic compound, it is contacted with an aqueous solution containing permanganic acid, and further contacted with A technology containing an aqueous solution such as an acid (Patent Document 3), but it requires a swelling process or there are products with low adhesion to plating after etching, which still has problems in industrial use.

Images