Multi-stage resin surface etching method, and plating method on resin using same

A resin and etching technology, applied in liquid chemical plating, metal material coating process, coating and other directions, can solve the problems of low adhesion, poor working environment, high cost, and achieve high adhesion and efficient etching. Effect

Pending Publication Date: 2020-01-17
JCU CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, in the above-mentioned etching treatment, since harmful hexavalent chromium is used to work at a high temperature of 60°C or higher, there are problems in that the working environment is deteriorated, and the waste water treatment also requires attention.
[0004] In addition, in recent years, a technique of etching the surface of plastics using permanganic acid has also been reported (Patent Document 1), but permanganic acid may decompose rapidly depending on the conditions of use, and there may be problems in industrial use.
[0005] Thereafter, in order to suppress the decomposition of the etching solution using the above-mentioned permanganic acid, it has also been reported to contain permanganic acid, a specific inorganic acid, and a The composition for etching treatment (Patent Document 2) containing one component of salt is expensive due to the use of the above components in a large amount, which still has problems in industrial use
[0006] In addition, in order to suppress the decomposition of the etching solution containing the above-mentioned permanganic acid, it has also been reported that after the resin is swelled with an aqueous dispersion or aqueous solution containing a specific organic compound, it is contacted with an aqueous solution containing permanganic acid, and further contacted with A technology containing an aqueous solution such as an acid (Patent Document 3), but it requires a swelling process or there are products with low adhesion to plating after etching, which still has problems in industrial use.

Method used

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  • Multi-stage resin surface etching method, and plating method on resin using same
  • Multi-stage resin surface etching method, and plating method on resin using same
  • Multi-stage resin surface etching method, and plating method on resin using same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0057]

[0058] A 50×100×3 mm ABS resin test piece (3001M: manufactured by UMGABS Co., Ltd.) was used as a sample. The sample was immersed in degreasing cleaning solution PC-1 and PC-2 (manufactured by JCU Co., Ltd.) at 60°C for 10 minutes, and then placed in a 50°C bath containing 10 ml / L of ENILEX WE (manufactured by JCU Co., Ltd.). Immerse in the surface conditioning solution for 10 minutes.

[0059] The sample subjected to degreasing and surface conditioning was treated by the etching process described in Table 1, and further immersed in a conditioning (catalyst imparting enhancement) treatment solution D-POP CDV (manufactured by JCU Corporation) at 25° C. for 1 minute.

[0060] In addition, the etchant used in the etching process described in Table 1 is as follows.

[0061] Chromate etching (existing method)

[0062] Chromic anhydride: 3.8mol / L

[0063] Sulfuric acid: 3.8mol / L

[0064] Liquid temperature 68°C

[0065] The method of the invention

[0066] Process (...

Embodiment 2

[0088] In the implementation method 1 of Example 1, the pH of the etching solution used in the step (a) is set to the value in Table 2, and the buffer solution in Table 3 is used as the pH buffer solution corresponding to the pH. In Example 1, electroless nickel plating was performed in the same manner. In addition, sodium hydroxide and sulfuric acid were used for pH adjustment. In addition, the electroless nickel plating layer was subjected to peel strength measurement and thermal shock test in the same manner as in Example 1. The results are shown in Table 2.

[0089] 【Table 2】

[0090]

[0091] * Carry out 5 sets of procedures (a) and (b)

[0092] 【table 3】

[0093] pH pH buffer 10.0 or above Carbonic acid / bicarbonate buffer 5.5～10.0 Boric acid / sodium tetraborate buffer 2.5～5.5 Acetic acid / sodium acetate buffer Below 2.5 Phosphate / sodium dihydrogen phosphate buffer

[0094] In the method of the present invention, any pH is no...

Embodiment 3

[0096] In implementation method 1 of Example 1, electroless nickel plating was performed similarly to Example 1 except having removed the pH buffering agent from the liquid used in process (a) and (b). When the peel strength measurement and the thermal shock test were performed on this electroless nickel plating layer in the same manner as in Example 1, the results were the same as in Embodiment Method 1.

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PUM

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Abstract

The present invention provides a resin surface etching method characterized in that, in etching a resin surface, one set of steps (a) and (b), is performed two or more times without performing a resinswelling step, wherein step (a) is a step for treating the resin surface with a solution containing an oxidizing agent and adsorbing the oxidizing agent on the resin surface, and step (b) is a step for activating the oxidizing agent adsorbed on the resin surface in step (a). This rein surface etching method provides a novel technique operable at an industrial level, as a resin etching technique that does not use a chromic acid.

Description

technical field [0001] The present invention relates to a multi-stage etching method for resin surfaces and a method for plating resins using the same. Background technique [0002] Conventionally, it is known that, in order to improve the adhesion between the plastic surface and the plating film, the plastic surface is treated with a mixed solution of chromic acid and sulfuric acid before the plating treatment in the case of metallizing the plastic surface by plating. Rough etching is performed. [0003] However, since the above-mentioned etching process uses harmful hexavalent chromium and operates at a high temperature of 60° C. or higher, there are problems in that the working environment is deteriorated, and the waste water treatment requires attention. [0004] In addition, in recent years, a technique of etching the surface of plastics using permanganic acid has also been reported (Patent Document 1), but permanganic acid may decompose rapidly depending on the condit...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C18/30
CPCC23C18/30C23C18/24C23C18/2086C23C18/32C23C18/1653C25D3/38C25D5/14C25D5/56C25D3/12C25D3/08C23C18/2073
Inventor 仓持保之石塚博士泉谷美代子
Owner JCU CORP
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