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A kind of thermoplastic photovoltaic module packaging adhesive film and preparation method

A photovoltaic module packaging and thermoplastic technology, applied in photovoltaic power generation, adhesives, electrical components, etc., can solve the problems of affecting the mechanical properties of the adhesive film, increasing the radiation dose, and high energy consumption in processing, and achieve good water vapor and oxygen barrier performance, Improve the bonding strength and simplify the production process

Active Publication Date: 2021-10-08
HANGZHOU FIRST APPLIED MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In order to meet the requirements of the operating temperature of photovoltaic modules, thermoplastic polyolefin photovoltaic module packaging materials use ethylene copolymerized olefin resins with a melting point higher than 90 ° C. Adhesive aids have poor compatibility and have the disadvantage of low bond strength
The method of using peroxide to initiate the grafting of silane coupling agent can improve its bonding strength, but the processing temperature needs to be above the decomposition temperature of peroxide, usually 140-190°C. Under this condition, functional molecules The grafting and cross-linking of polyolefin molecular chains are a pair of competing reactions, which are easy to form gels and lead to product scrapping
Moreover, high-temperature processing consumes a lot of energy, which can easily cause the breakage of polyolefin molecular segments and affect the mechanical properties of the film. The residual peroxide that has not fully reacted will also deteriorate the weather resistance of the packaging film.
[0005] The use of electron beam irradiation process to realize the grafting of thermoplastic polyolefin encapsulation film is relatively thermally induced chemical reaction treatment process, which can greatly improve the energy efficiency of polyolefin grafting, but compared with EVA, the required radiation dose is significantly increased.
Especially when using a colored packaging film, the packaging film must reach a certain degree of pre-crosslinking to avoid the occurrence of the colored film overflowing to the cell during the lamination process, which will further increase the radiation dose and easily cause the sealing film to be damaged. During the irradiation process, stretching occurs, which leads to the deterioration of the shrinkage performance of the encapsulation film or excessive residual internal stress, which in turn causes the colored film to be applied to the component, resulting in wrinkles

Method used

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  • A kind of thermoplastic photovoltaic module packaging adhesive film and preparation method
  • A kind of thermoplastic photovoltaic module packaging adhesive film and preparation method
  • A kind of thermoplastic photovoltaic module packaging adhesive film and preparation method

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Embodiment 1

[0029] A thermoplastic photovoltaic module encapsulation adhesive film comprises a three-layer co-extrusion film of an adhesive layer, a gas barrier layer and an adhesive layer. Wherein the bonding layer, in parts by weight, its main raw material composition is as follows: 5 parts of VA mass fraction is 33% ethylene-vinyl acetate copolymer, 95 parts of ethylene octene copolymer modified resins containing 2.5% amino group, 40 parts Magnesium oxide and 10 parts of titanium dioxide, 1 part of co-crosslinking agent trimethylolpropane triacrylate, 0.1 part of hindered amine light stabilizer bis-2,2,6,6-tetramethylpiperidinol sebacate Ester, 0.1 part UV absorber 2,2-tetramethylenebis(3,1-benzoxazin-4-one), 0.1 part tackifier γ-methacryloxypropyltrimethoxysilane . The raw material composition of the gas barrier layer is as follows: 100 parts of ethylene-α-octene copolymer, 10 parts of montmorillonite, 1 part of trimethylolpropane triacrylate as a crosslinking aid, 0.1 part of hinder...

Embodiment 2

[0032] A thermoplastic photovoltaic module encapsulation adhesive film comprises a three-layer co-extrusion film of an adhesive layer, a gas barrier layer and an adhesive layer. Wherein the bonding layer, in parts by weight, its main raw material composition is as follows: 50 parts of VA mass fractions are 28% ethylene-vinyl acetate copolymers, 15 parts contain 1.0% carboxyl ethylene and pentene copolymer modified resins, 28 parts of ethylene-α-olefin copolymer is ethylene-butene copolymer elastomer POE (trade name Exact) produced by ExxonMobil, and 7 parts of propylene-α-olefin copolymer is thermoplastic elastomer TPE (trade name PRIMALLOY) produced by Mitsubishi Chemical ), 20 parts of ammonium polyphosphate / pentaerythritol compound (mass ratio is 1:1) and 5 parts of titanium dioxide, 1 part of crosslinking agent trimethylolpropane trimethacrylate / pentaerythritol triacrylate Compound (mass ratio 3:2), 0.1 part of hindered amine light stabilizer bis-2,2,6,6-tetramethylpiperid...

Embodiment 3

[0035] A thermoplastic photovoltaic module encapsulation adhesive film comprises a three-layer co-extrusion film of an adhesive layer, a gas barrier layer and an adhesive layer. Wherein the bonding layer, in parts by weight, its main raw material composition is as follows: 10 parts of VA mass fractions are 25% ethylene-vinyl acetate copolymers, 50 parts contain 2.0% isocyanate groups of ethylene-butylene copolymer modified resins , 24 parts of ethylene-α-olefin copolymers are ethylene-butene copolymer elastomer POE (trade name Exact) produced by ExxonMobil, 8 parts of ethylene-1-octene copolymer elastomer POE (trade name ENGAGE) produced by DOW , 8 parts of propylene-α-olefin copolymer is thermoplastic elastomer TPE (trade name PRIMALLOY) produced by Mitsubishi Chemical, 15 parts of carbon black, 1 part of crosslinking agent trimethylolpropane triacrylate, 0.1 part of hindered amines Light stabilizer bis(1,2,2,6,6-pentamethyl-4-piperidinyl) sebacate / methyl-1,2,2,6,6-pentamethy...

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Abstract

The invention discloses a thermoplastic photovoltaic module encapsulation adhesive film and a preparation method thereof, which comprises a gas barrier layer and an adhesive layer formed on the upper and lower surfaces of the gas barrier layer, and the adhesive layer is composed of 100 parts by weight of the first photovoltaic matrix resin, 0.1-1 parts by weight of tackifier, 0.1-3 parts by weight of auxiliary crosslinking agent, 0-50 parts by weight of pigments and processing aids of 0-3 parts by weight; the first photovoltaic matrix resin is composed of 5- 50 parts by weight of ethylene-vinyl acetate resin, 15-95 parts by weight of modified polyolefin transparent resin and 0-35 parts by weight of polyolefin transparent resin; Degree of crosslinking. Because it does not contain a cross-linking agent, it can avoid cross-linking in the screw during extrusion processing, which can greatly increase the production speed. The processing technology is simple and the production efficiency is high. It is used in photovoltaic modules and has good weather resistance.

Description

technical field [0001] The invention relates to a photovoltaic module, in particular to a thermoplastic photovoltaic module packaging adhesive film and a preparation method. Background technique [0002] Photovoltaic modules, which are attracting attention as clean energy, are developing day by day, and the cost of photovoltaic modules is decreasing day by day. However, compared with conventional energy sources, grid parity cannot be achieved at present, and there is a continuous cost reduction demand for all components of photovoltaic modules. On the other hand, with the popularization of the application of photovoltaic modules, photovoltaic modules are used in various extreme climate conditions (desert, seaside, etc.), and higher requirements are put forward for the weather resistance of photovoltaic modules. [0003] Since the operating temperature of photovoltaic modules can reach above 75°C, ethylene-vinyl acetate elastomer (EVA) or cross-linked polyolefin photovoltaic ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J7/30C09J7/24C09J4/06C09J4/02C09J11/04C09J11/06C08L23/08C08K3/34C08K13/02H01L31/048
CPCC08K3/346C08L23/08C09J4/06C09J11/04C09J11/06C09J2423/046C09J7/24C09J7/30H01L31/0481C08L23/0815Y02E10/50
Inventor 彭瑞群熊曦王龙穆丹华周光大
Owner HANGZHOU FIRST APPLIED MATERIAL CO LTD