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Micro LED mass transfer method and device, packaging structure and display device

A transfer method and transfer device technology, applied in the direction of electrical components, electric solid devices, circuits, etc., can solve the problem of low transfer efficiency of Micro LED mass, and achieve the effect of simple operation and high transfer efficiency

Active Publication Date: 2020-01-21
深圳市科伦特电子有限公司
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  • Abstract
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Problems solved by technology

[0004] The purpose of the present invention is to provide a Micro LED mass transfer method, device, packaging structure, and display device to overcome the defect of low Micro LED mass transfer efficiency

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  • Micro LED mass transfer method and device, packaging structure and display device
  • Micro LED mass transfer method and device, packaging structure and display device
  • Micro LED mass transfer method and device, packaging structure and display device

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Embodiment Construction

[0035] The idea, specific structure and technical effects of the present invention will be clearly and completely described below in conjunction with the embodiments and accompanying drawings, so as to fully understand the purpose, features and effects of the present invention. Apparently, the described embodiments are only some of the embodiments of the present invention, rather than all of them. Based on the embodiments of the present invention, other embodiments obtained by those skilled in the art without creative efforts belong to The protection scope of the present invention. In addition, all the connection / connection relationships involved in the patent do not simply refer to the direct connection of components, but mean that a better connection structure can be formed by adding or reducing connection accessories according to specific implementation conditions. The various technical features in the present invention can be combined interactively on the premise of not co...

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Abstract

The invention relates to a Micro LED mass transfer method and device, a packaging structure and a display device. The Micro LED mass transfer method comprises the steps of setting a driving circuit substrate; arranging a first object carrying plate and a second object carrying plate; pouring Micro LED elements to the second object carrying plate; applying a vibration force to the first object carrying plate and the second object carrying plate; and bonding an electrode on the driving circuit substrate with the Micro LED elements. The Micro LED mass transfer device comprises components in the method, and the packaging structure is manufactured through the transfer method. The display device comprises the packaging structure. In the invention, the micro LED elements are poured into the second object carrying plate in batches; under an effect of the vibration force, the Micro LED elements fall into the first object carrying plate, mass transfer of the Micro LED elements is achieved afterthe Micro LED elements and the electrodes are bonded; and the mass transfer method is easy to operate and has high transfer efficiency.

Description

technical field [0001] The present invention relates to the technical field of semiconductor display manufacturing, in particular to a Micro LED mass transfer method, device, packaging structure, and display device. Background technique [0002] As a new generation of display technology, Micro LED (Micro Light Emitting Diode) has higher brightness and better luminous efficiency than the existing OLED (Organic Light Emitting Diode). Lower power, higher research and development value and use value. [0003] The advantage of Micro LED comes from the micron-level spacing. The traditional LED packaging mainly uses vacuum suction to transfer, but since the vacuum tube can only reach 80um under the physical limit, the size of Micro LED is basically smaller than 50um, so vacuum adsorption The method is no longer applicable to the transfer of Micro LED. Contents of the invention [0004] The object of the present invention is to provide a Micro LED mass transfer method, device, p...

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Application Information

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IPC IPC(8): H01L33/00H01L27/15
CPCH01L27/156H01L33/0095
Inventor 龚杰朱启滔段四才吴达豪黄杰
Owner 深圳市科伦特电子有限公司
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