Wafer processing thinning machine

Abstract

The invention discloses a wafer processing thinning machine. The wafer processing thinning machine structurally comprises a cover, a grinding head, an opening and closing device, a suction cup structure, a machine body and a control panel, wherein the control panel is arranged on the front end surface of the machine body; the cover is movably mounted on one side of the top end of the machine body;the opening and closing device is mounted between the cover and the machine body; the grinding head is mounted in the middle of the inner wall of the cover; the suction cup structure is mounted on the top end surface of the machine body corresponding to the grinding head; and the suction cup structure is matched with the grinding head. According to the wafer processing thinning machine, through the design of an air pipe on a suction cup, a suction port on the suction cup is independently differentiated, when the suction cup is broken under stress, no matter which direction a wafer cracks, thewafer can be adsorbed, and the situation that the wafer falls on a table top due to the loss of suction force and cracks secondarily is avoided; and through the design of a plug, when the air pipe isnot used or reduced, a mounting hole of the suction cup is blocked, and the situation that air dust enters the mounting hole and causes blockage is reduced.

Description

technical field [0001] The invention relates to the field of wafer processing equipment for chips, in particular to a wafer processing and thinning machine. Background technique [0002] In the wafer manufacturing process, high requirements are placed on the dimensional accuracy, geometric accuracy, surface cleanliness, and surface microlattice structure of the wafer. Therefore, in hundreds of processes, thinner wafers cannot be used, and only a certain thickness can be used. During the transfer and tape-out of the wafers in the process, usually before the integrated circuit packaging, it is necessary to remove a certain thickness of the excess substrate material on the back of the wafer. This process is called the wafer back thinning process, and the corresponding equipment is the wafer thinning machine. During the thinning process, because the thickness of the middle and edge of the wafer is inconsistent, when removing the middle thickness, it will be different due to its ...

AI Technical Summary

Problems solved by technology

This process is called the wafer back thinning process, and the corresponding equipment is the wafer thinning machine. During the thinning process, because the thickness of the middle and edge of the wafer is inconsistent, when removing the middle thickness, it will be different due to its different strength. , leading to breakage, the suction cup cannot be absorbed, and it falls directly to the workbench, becoming broken and troublesome to clean up

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