A method for heat dissipation of a flexible circuit board
A flexible circuit board, non-circuit technology, used in circuit thermal devices, circuits, printed circuits, etc., can solve problems such as poor heat dissipation of semiconductor components, and achieve the effect of avoiding excessive temperature and high heat dissipation efficiency
Active Publication Date: 2022-02-22
江苏上达半导体有限公司
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Problems solved by technology
[0004] The purpose of the present invention is to provide a method for heat dissipation of a flexible circuit board to solve the problem of poor heat dissipation of semiconductor elements on the flexible circuit board
Method used
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Embodiment Construction
[0020] The present invention will be described in further detail below in conjunction with the accompanying drawings.
[0021] Such as Figure 1-5 As shown, a method for heat dissipation of a flexible circuit board, the flexible circuit board includes a circuit area C and a non-circuit area A, and the non-circuit area A includes an input non-circuit area G and an output side non-circuit area H, including the following steps:
[0022] Step 1 When applying solder resist, apply solder resist on the circuit area C of the flexible circuit board, and do not apply solder resist on the non-circuit area A of the flexible circuit board, so that the solid copper foil on the non-circuit area A of the flexible circuit board revealed;
[0023] In step 2, after packaging the semiconductor element F, punching out the groove B along the copper foil on the non-circuit area A;
[0024] Step 3: Bending the non-circuit area A so that the non-circuit area G at the input end adheres to the upper s...
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The invention discloses a method for heat dissipation of a flexible circuit board, which comprises the following steps: Step 1: When coating the solder resist, apply the solder resist on the circuit area of the flexible circuit board, and do not apply the solder resist on the non-circuit area of the flexible circuit board Cover the solder resist to expose the solid copper foil on the non-circuit area of the flexible circuit board; step 2 punch out grooves along the copper foil after packaging the semiconductor components; step 3 bend the non-circuit area to make the input end non-circuit area adhered to the upper surface of the semiconductor component. The method does not need to add other heat dissipation equipment, and uses the solid copper foil on the base material of the flexible circuit board to connect with the semiconductor element to provide a heat dissipation channel, which is convenient to implement and has good heat dissipation effect.
Description
technical field [0001] The invention relates to the technical field of flexible circuit boards, in particular to a method for heat dissipation of flexible circuit boards. Background technique [0002] In the production of flexible circuit boards, the roll-to-roll production method is adopted, and the circuit pattern is formed on a roll of COF substrate composed of a metal layer (usually solid copper foil) and an insulating film layer by coating, exposure, development, etc. , and then perform electroplating, print solder resist, etc. on a specific area of the circuit pattern, set a protective layer, and then mount semiconductor electronic components at the device hole, and finally punch out a single COF product from the COF tape, and link it to other circuits board for the production of electronic products. [0003] There are semiconductor components installed on the flexible circuit board. Since the semiconductor components will generate heat during operation, the operati...
Claims
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IPC IPC(8): H05K1/02H05K1/18H05K3/00H05K3/30H01L23/367
CPCH05K1/0203H05K1/18H05K3/00H05K3/30H01L23/367
Inventor 张涛王健计晓东孙彬沈洪李晓华
Owner 江苏上达半导体有限公司