LED flip packaging structure and manufacturing method

Abstract

The invention relates to an LED flip packaging structure and a manufacturing method, which belong to the technical field of LEDs. The structure comprises a transparent substrate with high light transmittance, a copper circuit arranged on the transparent substrate, and an LED chip connected with the copper circuit, wherein the copper circuit is provided with a hole for light projection of the LED chip; the LED chip is inversely arranged on the hole of the copper circuit; a chip electrode of the LED chip is welded with the copper circuit; a metal sheet with good heat conduction performance is attached to the back surface of the LED chip; the hole between the LED chip and the transparent substrate is filled with bottom filling glue doped with fluorescent powder; and the periphery of the LED chip is filled with packaging glue.

Description

technical field [0001] The invention relates to an LED flip-chip packaging structure and a manufacturing method, belonging to the technical field of LEDs. Background technique [0002] With the continuous development and progress of the economy, my country's awareness of environmental protection and energy conservation has gradually increased, especially the continuous improvement of people's living standards, making people's requirements for lighting fixtures higher and higher. Traditional incandescent lamps consume too much energy and have been gradually replaced by energy-saving lamps. Although the energy consumption of energy-saving lamps is low, mercury pollution occurs during the production process and after use and disposal, which will cause damage to the environment and even endanger the human body; and because they are glass products, they are easily damaged and difficult to transport. [0003] The LED industry is one of the most watched industries in recent years....

AI Technical Summary

Problems solved by technology

[0004] Traditional formal-mounted LEDs need to use thin gold or aluminum wires to connect the LED chips and bracket electrodes through pressure welding, which is costly and complicated; the heat generated by the LED chips is transferred to the bracket through thin metal wires and die-bonding glue. Then it is transmitted to the circuit board by the bracket, and then dissipated into the air, the heat dissipation effect is poor, and the heat accumulation causes the optical performance of the LED to degrade, which reduces the product life; the cost of the phosphor is high, resulting in a high cost of the LED

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